Invention Grant
- Patent Title: Light emitting device
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Application No.: US17019352Application Date: 2020-09-14
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Publication No.: US11031532B2Publication Date: 2021-06-08
- Inventor: Motokazu Yamada , Yuichi Yamada
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: Mori & Ward, LLP
- Priority: JP2014-266765 20141226,JP2015-025503 20150212,JP2015-128516 20150626
- Main IPC: H01L33/54
- IPC: H01L33/54 ; H01L33/50

Abstract:
A light emitting device includes at least one LED package, and at least one light transmissive sealing member. Each of the at least one LED package includes a light emitting element, a wavelength converter, and a reflection member. The light emitting element is mounted on a mounting surface of a base and electrically connected to a conductor wiring. The wavelength converter is provided on an upper surface of the light emitting element. The reflection member covers a side surface and a lower surface of the light emitting element. Each of the at least one light transmissive sealing member includes a light diffusion material and covers each of the at least one LED package. Each of the at least one light transmissive sealing member has a projection shape with a substantially circular bottom surface facing the base and with a height in the light axis direction of the light emitting element.
Information query
IPC分类: