公开(公告)号：US11515296B2

公开(公告)日：2022-11-29

申请号：US17382699

申请日：2021-07-22

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada ,  Yuichi Yamada

IPC: H01L25/075 ,  H01L33/50 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  G02F1/13357 ,  H01L33/46 ,  F21V7/00 ,  F21V9/08 ,  F21V23/00 ,  H01L33/58 ,  H01L33/56 ,  G02F1/1335 ,  F21Y115/10

Abstract: A light-emitting device includes a base including a conductive wiring; a light-emitting element mounted on the base and configured to emit light; a light reflective film provided on an upper surface of the light-emitting element; and a encapsulant covering the light-emitting element and the light reflective film. A ratio (H/W) of a height (H) of the encapsulant to a width (W) of a bottom surface of the encapsulant is less than 0.5.

公开(公告)号：US12148870B2

公开(公告)日：2024-11-19

申请号：US18050896

申请日：2022-10-28

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada ,  Yuichi Yamada ,  Shinsaku Ikuta ,  Takeshi Tamura

IPC: H01L33/60 ,  F21V3/06 ,  H01L33/54 ,  F21Y105/16 ,  F21Y115/10

Abstract: An LED package includes a light source, a light transmissive member, and a light reflecting layer. The light source includes a resin package, a light emitting element and a wavelength conversion material. The resin package includes first and second leads and a resin member. The resin package defines a recess having a bottom face defined by portions of the first and second leads, and a portion of the resin member, and a lateral wall defined by a portion of the resin member. The light emitting element is disposed on or above the bottom face in the recess. The wavelength conversion material is disposed in the recess. The light transmissive member is disposed on or above the light source. The light reflecting layer is disposed on or above the light transmissive member at least on an upper side along an optical axis of the light emitting element.

公开(公告)号：US10032969B2

公开(公告)日：2018-07-24

申请号：US14968897

申请日：2015-12-15

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada ,  Yuichi Yamada

IPC: H01L33/54 ,  H01L33/50

Abstract: A light emitting device includes a base, at least one light emitting element, and a light transmissive sealing member. The base has a conductor wiring. The at least one light emitting element is mounted on the base. The at least one light emitting element is electrically connected to the conductor wiring. The light transmissive sealing member includes a light diffusion material. The light transmissive sealing member covers the at least one light emitting element. The light transmissive sealing member has a projection shape. The projection shape has a substantially circular bottom surface facing the base and a height in a light axis direction of the at least one light emitting element. The height is greater than a diameter of the substantially circular bottom surface.

公开(公告)号：US11769863B2

公开(公告)日：2023-09-26

申请号：US17981701

申请日：2022-11-07

Applicant: NICHIA CORPORATION

Inventor： Yuichi Yamada ,  Takeshi Tamura

IPC: H01L33/50 ,  H01L25/075 ,  G02F1/13357 ,  H01L33/60

CPC classification number: H01L33/505 ,  G02F1/133603 ,  H01L25/0753 ,  H01L33/60 ,  H01L2933/0041 ,  H01L2933/0058

Abstract: A light emitting device includes: a base; a phosphor frame positioned inward of edges of a lower face of the base; a light emitting element disposed in an area surrounded by the phosphor frame; and a light transmissive member contacting at least a portion of the edges of the lower face of the base and at least a portion of outer lateral faces of the phosphor frame.

公开(公告)号：US11649947B2

公开(公告)日：2023-05-16

申请号：US17353348

申请日：2021-06-21

Applicant: NICHIA CORPORATION

Inventor： Yuichi Yamada ,  Motokazu Yamada

IPC: F21V7/00 ,  F21K9/64 ,  H01L33/46 ,  H01L33/48 ,  H01L25/075 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L33/54 ,  F21V9/30 ,  F21V17/00 ,  F21V3/00 ,  F21V3/02 ,  F21Y115/10 ,  F21Y105/16 ,  F21V13/12

CPC classification number: F21V7/0083 ,  F21K9/64 ,  F21V9/30 ,  F21V17/002 ,  H01L25/0753 ,  H01L33/46 ,  H01L33/486 ,  H01L33/502 ,  H01L33/507 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  F21V3/00 ,  F21V3/02 ,  F21V13/12 ,  F21Y2105/16 ,  F21Y2115/10

Abstract: A light emitting device includes: a base; a light emitting element; a light reflective film located on an upper surface of the light emitting element; and a encapsulant. A ratio of a maximum width (Wmax) of the encapsulant with respect to a maximum width of the light emitting element, in a side view, is 2 or more. An outer shape of a part of the encapsulant located within a range of elevation angles that is in a range of 10° to 50° from a center of a mounting region at an upper surface of the base on which the light emitting element is mounted is formed to have a curved surface. A ratio (r/Wmax) of a radius of curvature (r) of the curved surface with respect to the maximum width (Wmax) of the encapsulant, in a side view, is in a range of 0.25 to 0.50.

公开(公告)号：US11631789B2

公开(公告)日：2023-04-18

申请号：US17485506

申请日：2021-09-27

Applicant: NICHIA CORPORATION

Inventor： Yuichi Yamada ,  Motokazu Yamada

IPC: H01L33/46 ,  H01L33/48 ,  H01L33/50 ,  H01L33/58 ,  H01L33/62 ,  H01L33/54 ,  H01L33/60

Abstract: A light emitting device includes a base including a support having a support surface. A light emitting element includes a semiconductor layer and a sapphire substrate provided on the semiconductor layer opposite to the support surface. A reflecting film provided on the sapphire substrate. A light-transmissive covering member is provided on the support surface. A height of the light-transmissive covering member viewed in a direction in which a width of the light-transmissive covering member appears smallest is 0.5 times or less of the width of the light-transmissive covering member. A light reflecting layer is provided on a first region of the base such that a first reflectivity in the first region of the base being higher than a second reflectivity in a second region of the base, the second region overlapping with the light emitting element and being surrounded by the first region as viewed in the height direction.

公开(公告)号：US11067250B2

公开(公告)日：2021-07-20

申请号：US15855573

申请日：2017-12-27

Applicant: NICHIA CORPORATION

Inventor： Yuichi Yamada ,  Motokazu Yamada

IPC: F21V7/00 ,  F21K9/64 ,  H01L33/46 ,  H01L33/48 ,  H01L25/075 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L33/54 ,  F21V9/30 ,  F21V17/00 ,  F21V3/00 ,  F21V3/02 ,  F21Y115/10 ,  F21Y105/16 ,  F21V13/12

Abstract: A light emitting device includes: a base; a light emitting element; a light reflective film located on an upper surface of the light emitting element; and a encapsulant. A ratio of a maximum width (Wmax) of the encapsulant with respect to a maximum width of the light emitting element, in a side view, is 2 or more. An outer shape of a part of the encapsulant located within a range of elevation angles that is in a range of 10° to 50° from a center of a mounting region at an upper surface of the base on which the light emitting element is mounted is formed to have a curved surface. A ratio (r/Wmax) of a radius of curvature (r) of the curved surface with respect to the maximum width (Wmax) of the encapsulant, in a side view, is in a range of 0.25 to 0.50.

公开(公告)号：US11031532B2

公开(公告)日：2021-06-08

申请号：US17019352

申请日：2020-09-14

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada ,  Yuichi Yamada

IPC: H01L33/54 ,  H01L33/50

Abstract: A light emitting device includes at least one LED package, and at least one light transmissive sealing member. Each of the at least one LED package includes a light emitting element, a wavelength converter, and a reflection member. The light emitting element is mounted on a mounting surface of a base and electrically connected to a conductor wiring. The wavelength converter is provided on an upper surface of the light emitting element. The reflection member covers a side surface and a lower surface of the light emitting element. Each of the at least one light transmissive sealing member includes a light diffusion material and covers each of the at least one LED package. Each of the at least one light transmissive sealing member has a projection shape with a substantially circular bottom surface facing the base and with a height in the light axis direction of the light emitting element.

公开(公告)号：US10784419B2

公开(公告)日：2020-09-22

申请号：US15160444

申请日：2016-05-20

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada ,  Tomonori Ozaki ,  Shinsaku Ikuta ,  Yuichi Yamada

IPC: H01L33/54 ,  H01L33/58 ,  H01L33/56 ,  H01L33/50 ,  H01L33/52

Abstract: A light emitting device includes a light emitting element; a sealing resin covering the light emitting element; and a light diffusing material contained in the sealing resin. When a difference in refractive index at 10° C. between the sealing resin and the light diffusing material is Δn1 and a difference in refractive index at 50° C. between the sealing resin and the light diffusing material is Δn2, a ratio of Δn2 to Δn1 is in a range of 95% to 105%.

公开(公告)号：US10720552B2

公开(公告)日：2020-07-21

申请号：US15608791

申请日：2017-05-30

Applicant: NICHIA CORPORATION

Inventor： Yuichi Yamada ,  Motokazu Yamada

IPC: H01L33/44 ,  H01L33/46 ,  H01L33/38 ,  H01L33/50 ,  H01L33/54 ,  H01L33/62 ,  H01L33/20 ,  H01L33/26 ,  H01L33/40 ,  H01L33/60

Abstract: A light emitting device includes: a substrate; a light emitting element disposed on the substrate, the light emitting element having an upper surface and a lateral surface; a reflecting layer located on the upper surface of the light emitting element; a first light-transmissive member having a first surface in contact with the lateral surface of the light emitting element, and a second surface that is inclined toward the substrate in a direction outward from the light emitting element; and a second light-transmissive member in contact with the second surface and covering the light emitting element. A refractive index of the first light-transmissive is smaller than a refractive index of the second light-transmissive member.