Invention Grant
- Patent Title: Non-volatile memory using a reduced number of interconnect terminals
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Application No.: US15843545Application Date: 2017-12-15
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Publication No.: US11036409B2Publication Date: 2021-06-15
- Inventor: Zhenyu Zhu , Chai Huat Gan , Mikal Hunsaker
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: G06F3/06
- IPC: G06F3/06 ; G06F12/02 ; G06F13/42 ; G06F13/16

Abstract:
A first signal may be received from a memory device at a first interconnect terminal of a number of interconnect terminals via a serial communication interface that indicates the memory device includes a NAND type memory device. Whether a second signal that indicates the NAND type memory device is initialized has been received from the memory device at a second interconnect terminal of the number of interconnect terminals may be determined. An operation associated with the NAND type memory device may be performed at the second interconnect terminal and a third interconnect terminal in response to determining the second signal has been received from the memory device indicating the NAND type memory device is initialized.
Public/Granted literature
- US20190042087A1 NON-VOLATILE MEMORY USING A REDUCED NUMBER OF INTERCONNECT TERMINALS Public/Granted day:2019-02-07
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