Invention Grant
- Patent Title: Formation of a two-layer via structure to mitigate damage to a display device
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Application No.: US16601712Application Date: 2019-10-15
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Publication No.: US11069873B2Publication Date: 2021-07-20
- Inventor: Yung-Chang Chang , Ming Chyi Liu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Potashnik, LLC
- Main IPC: H01L51/52
- IPC: H01L51/52 ; H01L27/32 ; H01L51/56

Abstract:
In some embodiments, the present disclosure relates to a display device that includes an isolation structure disposed over a reflector electrode, a transparent electrode disposed over the isolation structure, an optical emitter structure disposed over the transparent electrode, and a via structure. The via structure extends from the transparent electrode at a top surface of the isolation structure to a top surface of the reflector electrode. The via structure includes a center horizontal segment that contacts the top surface of the reflector electrode, a sidewall vertical segment that contacts an inner sidewall of the isolation structure, and an upper horizontal segment that is connected to the center horizontal segment by the sidewall vertical segment. The upper horizontal segment is thicker than the center horizontal segment.
Public/Granted literature
- US20210111366A1 FORMATION OF A TWO-LAYER VIA STRUCTURE TO MITIGATE DAMAGE TO A DISPLAY DEVICE Public/Granted day:2021-04-15
Information query
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