Invention Grant
- Patent Title: Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate
-
Application No.: US17005002Application Date: 2020-08-27
-
Publication No.: US11075166B2Publication Date: 2021-07-27
- Inventor: Eric J. Li , Timothy A. Gosselin , Yoshihiro Tomita , Shawna M. Liff , Amram Eitan , Mark Saltas
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L21/56 ; H01L23/13 ; H01L23/48 ; H01L23/00 ; H01L25/065 ; H01L21/48 ; H01L23/31
Abstract:
A microelectronic structure includes a microelectronic substrate having a first surface and a cavity extending into the substrate from the microelectronic substrate first surface, a first microelectronic device and a second microelectronic device attached to the microelectronic substrate first surface, and a microelectronic bridge disposed within the microelectronic substrate cavity and attached to the first microelectronic device and to the second microelectronic device. In one embodiment, the microelectronic structure may include a reconstituted wafer formed from the first microelectronic device and the second microelectronic device. In another embodiment, a flux material may extend between the first microelectronic device and the microelectronic bridge and between the second microelectronic device and the microelectronic bridge.
Information query
IPC分类:
