Invention Grant
- Patent Title: Semiconductor device and method
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Application No.: US16568518Application Date: 2019-09-12
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Publication No.: US11081396B2Publication Date: 2021-08-03
- Inventor: Shao-Jyun Wu , Hung-Chi Wu , Chia-Ching Lee , Pin-Hsuan Yeh , Hung-Chin Chung , Hsien-Ming Lee , Chien-Hao Chen , Sheng-Liang Pan , Huan-Just Lin
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/8234
- IPC: H01L21/8234 ; H01L29/78 ; H01L29/66 ; H01L29/417 ; H01L21/02

Abstract:
An improved work function layer and a method of forming the same are disclosed. In an embodiment, the method includes forming a semiconductor fin extending from a substrate; depositing a dielectric layer over the semiconductor fin; depositing a first work function layer over the dielectric layer; and exposing the first work function layer to a metastable plasma of a first reaction gas, a metastable plasma of a generation gas, and a metastable plasma of a second reaction gas, the first reaction gas being different from the second reaction gas.
Public/Granted literature
- US20210082768A1 Semiconductor Device and Method Public/Granted day:2021-03-18
Information query
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