A method for forming a chip package structure is provided. The method includes forming a conductive structure over a substrate. The substrate includes a dielectric layer and a wiring layer in the dielectric layer, and the conductive structure is electrically connected to the wiring layer. The method includes forming a first molding layer over the substrate and surrounding the conductive structure. The method includes forming a redistribution structure over the first molding layer and the conductive structure. The method includes bonding a chip structure to the redistribution structure.