Invention Grant
- Patent Title: Wafer level mold chase
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Application No.: US16413915Application Date: 2019-05-16
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Publication No.: US11114313B2Publication Date: 2021-09-07
- Inventor: Hsien-Wen Liu , Po-Hao Tsai , Yi-Wen Wu , Shin-Puu Jeng
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L21/56
- IPC: H01L21/56 ; B29C45/34 ; B29C45/27 ; B29L31/34
Abstract:
A mold chase is provided, including a lower mold support and an upper mold support which are configured to be pressed together to form a mold cavity therebetween for receiving a wafer level substrate. The mold chase also includes multiple gates and at least one vent disposed along the periphery of the mold cavity. The gates are configured to allow a mold material to be injected into the mold cavity, and the vents are configured to release gas from the mold cavity. The distance between one of the gates and the closest vent is less than the diameter of the mold cavity.
Information query
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