Invention Grant
- Patent Title: Optoelectronic module assembly and manufacturing method
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Application No.: US16719194Application Date: 2019-12-18
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Publication No.: US11114573B2Publication Date: 2021-09-07
- Inventor: Martin Lukas Balimann , Matthias Gloor , Philippe Bouchilloux , Jukka Alasirnio , Hartmut Rudmann , Nicola Spring
- Applicant: ams Sensors Singapore Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: ams Sensors Singapore Pte. Ltd.
- Current Assignee: ams Sensors Singapore Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Michael Best and Friedrich LLP
- Main IPC: H01L31/02
- IPC: H01L31/02 ; H01L31/0203 ; H01L27/146 ; H01L31/0232 ; H05K1/02 ; H01S5/023 ; H01S5/0233 ; H01S5/0235 ; H01S5/02253 ; H01L31/024 ; H01L33/48 ; H01L33/58 ; H01L33/62 ; H01L33/64 ; H01L51/52 ; H01S5/02208 ; H01S5/024 ; H01L31/18

Abstract:
An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.
Information query
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