公开(公告)号：US10566468B2

公开(公告)日：2020-02-18

申请号：US16086868

申请日：2017-03-23

Applicant: AMS SENSORS SINGAPORE PTE. LTD.

Inventor： Martin Lukas Balimann ,  Matthias Gloor ,  Philippe Bouchilloux ,  Jukka Alasirniö ,  Hartmut Rudmann ,  Nicola Spring

IPC: H01L31/02 ,  H01L31/0203 ,  H01L27/146 ,  H01L31/0232 ,  H05K1/02 ,  H01L31/024 ,  H01L33/48 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64 ,  H01L51/52 ,  H01S5/022 ,  H01S5/024 ,  H01L31/18

Abstract: An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.

公开(公告)号：US11114573B2

公开(公告)日：2021-09-07

申请号：US16719194

申请日：2019-12-18

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Martin Lukas Balimann ,  Matthias Gloor ,  Philippe Bouchilloux ,  Jukka Alasirnio ,  Hartmut Rudmann ,  Nicola Spring

IPC: H01L31/02 ,  H01L31/0203 ,  H01L27/146 ,  H01L31/0232 ,  H05K1/02 ,  H01S5/023 ,  H01S5/0233 ,  H01S5/0235 ,  H01S5/02253 ,  H01L31/024 ,  H01L33/48 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64 ,  H01L51/52 ,  H01S5/02208 ,  H01S5/024 ,  H01L31/18

Abstract: An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.