公开(公告)号：US20210014429A1

公开(公告)日：2021-01-14

申请号：US17013287

申请日：2020-09-04

Applicant: AMS SENSORS SINGAPORE PTE. LTD.

Inventor： Jukka Alasirnio ,  Tobias Senn ,  Ohad Meitav ,  Moshe Doron ,  Alireza Yasan ,  Mario Cesana ,  Florin Cutu ,  Hartmut Rudmann ,  Markus Rossi ,  Peter Roentgen ,  Daniel Perez Calero ,  Bassam Hallal ,  Jens Geiger

IPC: H04N5/247 ,  G03B37/04 ,  G03B35/08 ,  G03B15/05 ,  G03B17/12 ,  G02B13/00 ,  H04N5/225 ,  H04N5/33

Abstract: Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.

公开(公告)号：US11114573B2

公开(公告)日：2021-09-07

申请号：US16719194

申请日：2019-12-18

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Martin Lukas Balimann ,  Matthias Gloor ,  Philippe Bouchilloux ,  Jukka Alasirnio ,  Hartmut Rudmann ,  Nicola Spring

IPC: H01L31/02 ,  H01L31/0203 ,  H01L27/146 ,  H01L31/0232 ,  H05K1/02 ,  H01S5/023 ,  H01S5/0233 ,  H01S5/0235 ,  H01S5/02253 ,  H01L31/024 ,  H01L33/48 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64 ,  H01L51/52 ,  H01S5/02208 ,  H01S5/024 ,  H01L31/18

Abstract: An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.

公开(公告)号：US11575843B2

公开(公告)日：2023-02-07

申请号：US17013287

申请日：2020-09-04

Applicant: AMS SENSORS SINGAPORE PTE. LTD.

Inventor： Jukka Alasirnio ,  Tobias Senn ,  Ohad Meitav ,  Moshe Doron ,  Alireza Yasan ,  Mario Cesana ,  Florin Cutu ,  Hartmut Rudmann ,  Markus Rossi ,  Peter Roentgen ,  Daniel Perez Calero ,  Bassam Hallal ,  Jens Geiger

IPC: H04N5/247 ,  G03B37/04 ,  G03B35/08 ,  G03B15/05 ,  G03B17/12 ,  G02B13/00 ,  H04N5/225 ,  H04N5/33

Abstract: Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.

公开(公告)号：US10373996B2

公开(公告)日：2019-08-06

申请号：US15651510

申请日：2017-07-17

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Stephan Heimgartner ,  Ville Kettunen ,  Nicola Spring ,  Alexander Bietsch ,  Mario Cesana ,  Hartmut Rudmann ,  Jukka Alasirnio ,  Robert Lenart

IPC: H04N5/225 ,  H01L27/146 ,  G02B27/00 ,  H01L31/18 ,  H01L31/0216 ,  H01L31/0232

Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.