Invention Grant
- Patent Title: Structure of semiconductor device and method for fabricating the same
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Application No.: US16798126Application Date: 2020-02-21
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Publication No.: US11127752B2Publication Date: 2021-09-21
- Inventor: Chia-Ching Hsu , Wang Xiang , Shen-De Wang , Chun-Sung Huang
- Applicant: United Microelectronics Corp.
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: J.C. Patents
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L27/11573 ; H01L27/11568 ; H01L29/423 ; H01L29/40 ; H01L29/66 ; H01L29/792 ; H01L21/765 ; H01L21/28 ; H01L29/78

Abstract:
A semiconductor device includes a substrate, having cell region and high-voltage region. A memory cell is on the substrate within the cell region. The memory cell includes a memory gate structure and a selection gate structure on the substrate. A first spacer is sandwiched between or respectively on sidewalls of the memory cell structure and the selection gate structure. First high-voltage transistor is on the substrate within the high-voltage region. A first composite gate structure of the first high-voltage transistor includes a first gate structure on the substrate, an insulating layer with a predetermined thickness on the substrate in a -like structure or an L-like structure at cross-section, and a second gate structure on the insulating layer along the -like structure or the L-like structure. The selection gate structure and the second gate structure are originated from a same preliminary conductive layer.
Public/Granted literature
- US20210265376A1 STRUCTURE OF SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2021-08-26
Information query
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