Invention Grant
- Patent Title: Solid-state imaging device, method of manufacturing the same, and electronic apparatus
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Application No.: US16169735Application Date: 2018-10-24
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Publication No.: US11127771B2Publication Date: 2021-09-21
- Inventor: Yusuke Tanaka , Toshifumi Wakano , Keiji Tatani , Takashi Nagano , Hayato Iwamoto , Keiichi Nakazawa , Tomoyuki Hirano , Shinpei Yamaguchi , Shunsuke Maruyama
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Sheridan Ross P.C.
- Priority: JP2013-048404 20130311,JP2013-159565 20130731
- Main IPC: H01L27/148
- IPC: H01L27/148 ; H01L27/146

Abstract:
Solid-state imaging devices, methods of producing a solid-state imaging device, and electronic apparatuses are provided. More particularly, a solid-state image device includes a silicon substrate, and at least a first photodiode formed in the silicon substrate. The device also includes an epitaxial layer with a first surface adjacent a surface of the silicon substrate, and a transfer transistor with a gate electrode that extends from the at least a first photodiode to a second surface of the epitaxial layer opposite the first surface. In further embodiments, a solid-state imaging device with a plurality of pixels formed in a second semiconductor substrate wherein the pixels are symmetrical with respect to a center point is provided. A floating diffusion is formed in an epitaxial layer, and a plurality of transfer gate electrodes that are each electrically connected to the floating diffusion by one of the transfer gate electrodes is provided.
Public/Granted literature
- US20190057990A1 SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS Public/Granted day:2019-02-21
Information query
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