The present disclosure is directed to a method and system for monitoring a distance between a shutter and a reference point in a processing module. For example, the method includes moving a shutter relative to a substrate support in a wafer processing module and determining a distance between the shutter and a wall of the wafer processing module with a measurement device. In response to the distance being greater than a value, the method further includes transferring a substrate to the substrate support, and in response to the distance being equal to or less than the value, the method includes resetting the shutter.