Invention Grant
- Patent Title: Runtime localized cooling of high-performance processors
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Application No.: US16228036Application Date: 2018-12-20
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Publication No.: US11137809B2Publication Date: 2021-10-05
- Inventor: Karthik Rao , Wei Huang , Xudong An , Manish Arora , Joseph L. Greathouse
- Applicant: Advanced Micro Devices, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Advanced Micro Devices, Inc.
- Current Assignee: Advanced Micro Devices, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Zagorin Cave LLP
- Main IPC: G06F1/26
- IPC: G06F1/26 ; G06F1/20
Abstract:
A plurality of thermal electric cooler (TEC) elements are formed in a TEC grid structure. Control logic dynamically varies a supply current supplied to each TEC element (or group of TEC elements) in the TEC grid based on changes in power density respectively associated with areas cooled by each of the TEC elements or group of TEC elements.
Information query
