Invention Grant
- Patent Title: Lattice bump interconnect
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Application No.: US16236042Application Date: 2018-12-28
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Publication No.: US11145598B2Publication Date: 2021-10-12
- Inventor: Benjamin Stassen Cook , Nazila Dadvand , Archana Venugopal , Luigi Colombo
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L21/768 ; H01L23/532
Abstract:
An interconnect structure for a semiconductor device includes a plurality of unit cells. Each unit cell is formed of interconnected conducting segments. The plurality of unit cells forms a conducting lattice.
Public/Granted literature
- US20190206788A1 LATTICE BUMP INTERCONNECT Public/Granted day:2019-07-04
Information query
IPC分类:
