Invention Grant
- Patent Title: Thermally-conductive pressure-sensitive adhesive sheet
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Application No.: US14892243Application Date: 2014-05-29
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Publication No.: US11149171B2Publication Date: 2021-10-19
- Inventor: Kenji Furuta , Yoshio Terada
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Ibaraki
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Ibaraki
- Agency: Sughrue Mion, PLLC
- Priority: JPJP2013-116542 20130601,JPJP2014-020794 20140205,JPJP2014-097977 20140509
- International Application: PCT/JP2014/064316 WO 20140529
- International Announcement: WO2014/192886 WO 20141204
- Main IPC: C09J11/04
- IPC: C09J11/04 ; C09J7/38 ; C08K3/22 ; C09J9/00 ; C09J133/08 ; C09K5/14

Abstract:
A thermally-conductive pressure-sensitive adhesive sheet including a pressure-sensitive adhesive layer containing thermally-conductive particles. One side of the sheet is an adhesive face, and the other side is a non-adhesive face. The thermally-conductive pressure-sensitive adhesive sheet may include a non-adhesive layer on or over only one side of the pressure-sensitive adhesive layer. In this case, the ratio of the thickness of the non-adhesive layer to the thickness of the pressure-sensitive adhesive layer is preferably 0.04 to 0.6. The thermally-conductive pressure sensitive adhesive sheet preferably has a thermal resistance of 6 K·cm2/W or less. The thermally-conductive pressure sensitive adhesive sheet preferably has a total thickness of 50 to 500 μm.
Public/Granted literature
- US20160152872A1 THERMALLY-CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEET Public/Granted day:2016-06-02
Information query
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