Thermally-conductive pressure-sensitive adhesive sheet

    公开(公告)号:US11149171B2

    公开(公告)日:2021-10-19

    申请号:US14892243

    申请日:2014-05-29

    Abstract: A thermally-conductive pressure-sensitive adhesive sheet including a pressure-sensitive adhesive layer containing thermally-conductive particles. One side of the sheet is an adhesive face, and the other side is a non-adhesive face. The thermally-conductive pressure-sensitive adhesive sheet may include a non-adhesive layer on or over only one side of the pressure-sensitive adhesive layer. In this case, the ratio of the thickness of the non-adhesive layer to the thickness of the pressure-sensitive adhesive layer is preferably 0.04 to 0.6. The thermally-conductive pressure sensitive adhesive sheet preferably has a thermal resistance of 6 K·cm2/W or less. The thermally-conductive pressure sensitive adhesive sheet preferably has a total thickness of 50 to 500 μm.

    Pressure-sensitive adhesive sheet and magnetic disc device

    公开(公告)号:US10647891B2

    公开(公告)日:2020-05-12

    申请号:US16355921

    申请日:2019-03-18

    Abstract: Provided is a PSA sheet that has a high level of moisture resistance while maintaining good holding power with reduced gas emission. The PSA sheet provided by this invention comprises a moisture-impermeable layer and a PSA layer provided to one face of the moisture-impermeable layer. The PSA layer comprises a polymer A having a weight average molecular weight of 5×104 or higher as a base polymer and a polymer B having a number average molecular weight of 1000 or higher and a weight average molecular weight lower than 5×104.

    Resin sheet and adhesive-layer-having resin sheet

    公开(公告)号:US11434341B2

    公开(公告)日:2022-09-06

    申请号:US16638340

    申请日:2018-08-07

    Abstract: A resin sheet with a pressure-sensitive adhesive layer including the resin sheet. The resin sheet including a main surface A and a main surface B opposite to each other across a thickness “d”, where the resin sheet has a 50% compression load of 20 N/cm2 or less at 23±5° C. in a direction of the thickness “d”, which is measured in conformity with a method of measuring a compression hardness described in JIS K 6767:1999; where the resin sheet has a Poisson's ratio at 23° C. of 0.10 or less; and the resin sheet has a thickness recovery ratio of 40% or more when compressed by 20% in the direction of the thickness “d” at 23° C.

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