Invention Grant
- Patent Title: Lift-off embedded micro and nanostructures
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Application No.: US16107566Application Date: 2018-08-21
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Publication No.: US11152227B2Publication Date: 2021-10-19
- Inventor: Richard Swartwout , Farnaz Niroui , Vladimir Bulovic , Jeffrey H. Lang , Joel Jean
- Applicant: Massachusetts Institute of Technology
- Applicant Address: US MA Cambridge
- Assignee: Massachusetts Institute of Technology
- Current Assignee: Massachusetts Institute of Technology
- Current Assignee Address: US MA Cambridge
- Agency: Wolf, Greenfield & Sacks, P.C.
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L21/02 ; H01L23/31 ; H01L23/10 ; H01L29/06
Abstract:
A method includes encapsulating structures disposed on or over a surface of a substrate in an encapsulant. The method also includes separating the encapsulant from the substrate. An apparatus includes a composite film having structures embedded in an encapsulant. The composite film has a surface with a surface roughness of less than one nm. An apparatus includes an encapsulant film having a surface with indentations formed therein. The surface has a surface roughness apart from the indentations of less than one nm.
Public/Granted literature
- US20190080932A1 LIFT-OFF EMBEDDED MICRO AND NANOSTRUCTURES Public/Granted day:2019-03-14
Information query
IPC分类:
