公开(公告)号：US11152227B2

公开(公告)日：2021-10-19

申请号：US16107566

申请日：2018-08-21

Applicant: Massachusetts Institute of Technology

Inventor： Richard Swartwout ,  Farnaz Niroui ,  Vladimir Bulovic ,  Jeffrey H. Lang ,  Joel Jean

IPC: H01L21/56 ,  H01L21/02 ,  H01L23/31 ,  H01L23/10 ,  H01L29/06

Abstract: A method includes encapsulating structures disposed on or over a surface of a substrate in an encapsulant. The method also includes separating the encapsulant from the substrate. An apparatus includes a composite film having structures embedded in an encapsulant. The composite film has a surface with a surface roughness of less than one nm. An apparatus includes an encapsulant film having a surface with indentations formed therein. The surface has a surface roughness apart from the indentations of less than one nm.

公开(公告)号：US20190080932A1

公开(公告)日：2019-03-14

申请号：US16107566

申请日：2018-08-21

Applicant: Massachusetts Institute of Technology

Inventor： Richard Swartwout ,  Farnaz Niroui ,  Vladimir Bulovic ,  Jeffrey H. Lang ,  Joel Jean

IPC: H01L21/56 ,  H01L29/06 ,  H01L23/31 ,  H01L21/02

Abstract: A method includes encapsulating structures disposed on or over a surface of a substrate in an encapsulant. The method also includes separating the encapsulant from the substrate. An apparatus includes a composite film having structures embedded in an encapsulant. The composite film has a surface with a surface roughness of less than one nm. An apparatus includes an encapsulant film having a surface with indentations formed therein. The surface has a surface roughness apart from the indentations of less than one nm.