Invention Grant
- Patent Title: Anti-backout latch for interconnect system
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Application No.: US16325456Application Date: 2017-08-15
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Publication No.: US11171432B2Publication Date: 2021-11-09
- Inventor: Liam Parkes , Eric Zbinden , Keith Guetig , Jignesh H. Shah , Jean Karlo Williams Barnett , Chadrick Paul Faith , R. Brad Bettman
- Applicant: SAMTEC INC.
- Applicant Address: US IN New Albany
- Assignee: SAMTEC INC.
- Current Assignee: SAMTEC INC.
- Current Assignee Address: US IN New Albany
- Agency: BakerHostetler
- International Application: PCT/US2017/046918 WO 20170815
- International Announcement: WO2018/035108 WO 20180222
- Main IPC: H01R12/70
- IPC: H01R12/70 ; G02B6/42 ; H01R12/77 ; H01R12/83 ; H01R13/639

Abstract:
An interconnect system includes various anti-backout latches that are movable between an engaged position and a disengaged position. When in the engaged position, the anti-backout latches can be configured to prevent an interconnect module, such as an optical transceiver, from becoming unmated from a host module. When in the disengaged position, the anti-backout latches permit the interconnect module to become unmated from a host module. Securement members are also disclosed that secure a heat sink to a module housing of the interconnect module.
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