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公开(公告)号：US11171432B2
公开(公告)日：2021-11-09
申请号：US16325456
申请日：2017-08-15
Applicant: SAMTEC INC.
Inventor： Liam Parkes , Eric Zbinden , Keith Guetig , Jignesh H. Shah , Jean Karlo Williams Barnett , Chadrick Paul Faith , R. Brad Bettman
IPC: H01R12/70 , G02B6/42 , H01R12/77 , H01R12/83 , H01R13/639
Abstract: An interconnect system includes various anti-backout latches that are movable between an engaged position and a disengaged position. When in the engaged position, the anti-backout latches can be configured to prevent an interconnect module, such as an optical transceiver, from becoming unmated from a host module. When in the disengaged position, the anti-backout latches permit the interconnect module to become unmated from a host module. Securement members are also disclosed that secure a heat sink to a module housing of the interconnect module.
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公开(公告)号：US11476603B2
公开(公告)日：2022-10-18
申请号：US17126117
申请日：2020-12-18
Applicant: Samtec, Inc.
Inventor： Jonathan Earl Buck , Keith Guetig
Abstract: An electrical connector includes electrical contacts that are configured to be mounted to an electrical cable, and mating ends that are configured to be surface mounted to a contact pad of an underlying substrate, such that the mating ends flex and apply a pressure against the contact pad.
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公开(公告)号：US10985479B2
公开(公告)日：2021-04-20
申请号：US16329272
申请日：2017-08-30
Applicant: SAMTEC INC.
Inventor： Jonathan Earl Buck , Keith Guetig
Abstract: An electrical connector includes electrical contacts that are configured to be mounted to an electrical cable, and mating ends that are configured to be surface mounted to a contact pad of an underlying substrate, such that the mating ends flex and apply a pressure against the contact pad.
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公开(公告)号：US20220029323A1
公开(公告)日：2022-01-27
申请号：US17496558
申请日：2021-10-07
Applicant: SAMTEC INC.
Inventor： Liam PARKES , Eric ZBINDEN , Keith Guetig , Jignesh H. Shah , Jean Karlo Williams Barnett , Chadrick Paul Faith , R. Brad Bettman
IPC: H01R12/70 , G02B6/42 , H01R12/77 , H01R12/83 , H01R13/639
Abstract: An interconnect system includes various anti-backout latches that are movable between an engaged position and a disengaged position. When in the engaged position, the anti-backout latches can be configured to prevent an interconnect module, such as an optical transceiver, from becoming unmated from a host module. When in the disengaged position, the anti-backout latches permit the interconnect module to become unmated from a host module. Securement members are also disclosed that secure a heat sink to a module housing of the interconnect module.
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公开(公告)号：US20210151914A1
公开(公告)日：2021-05-20
申请号：US17126117
申请日：2020-12-18
Applicant: Samtec, Inc.
Inventor： Jonathan Earl Buck , Keith Guetig
Abstract: An electrical connector includes electrical contacts that are configured to be mounted to an electrical cable, and mating ends that are configured to be surface mounted to a contact pad of an underlying substrate, such that the mating ends flex and apply a pressure against the contact pad.
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Patent Agency Ranking
公开(公告)号：US09651752B2
公开(公告)日：2017-05-16
申请号：US15157548
申请日：2016-05-18
Applicant: Samtec, Inc.
Inventor： Eric Zbinden , Randall Musser , Jean-Marc André Verdiell , John Mongold , Brian Vicich , Keith Guetig
IPC: G02B6/42 , H04B1/3827 , H04B10/40 , H04B10/27 , H04B10/25 , H04B10/80 , H05K7/20 , H01R13/639
CPC classification number: G02B6/4284 , G02B6/4232 , G02B6/4246 , G02B6/4249 , G02B6/4261 , G02B6/4269 , G02B6/4278 , G02B6/4279 , G02B6/428 , G02B6/4292 , G02B6/4293 , H01L2224/48091 , H01L2224/49175 , H01R12/716 , H01R13/639 , H04B1/3833 , H04B10/2504 , H04B10/27 , H04B10/40 , H04B10/801 , H04B10/803 , H05K7/20418 , H01L2924/00014
Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
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公开(公告)号：US09841572B2
公开(公告)日：2017-12-12
申请号：US15181762
申请日：2016-06-14
Applicant: Samtec, Inc.
Inventor： Eric Zbinden , Randall Musser , Jean-Marc André Verdiell , John Mongold , Brian Vicich , Keith Guetig
IPC: G02B6/42 , H04B1/3827 , H04B10/40 , H04B10/27 , H04B10/25 , H04B10/80 , H05K7/20 , H01R13/639
CPC classification number: G02B6/4284 , G02B6/4232 , G02B6/4246 , G02B6/4249 , G02B6/4261 , G02B6/4269 , G02B6/4278 , G02B6/4279 , G02B6/428 , G02B6/4292 , G02B6/4293 , H01L2224/48091 , H01L2224/49175 , H01R12/716 , H01R13/639 , H04B1/3833 , H04B10/2504 , H04B10/27 , H04B10/40 , H04B10/801 , H04B10/803 , H05K7/20418 , H01L2924/00014
Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
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公开(公告)号：US09374165B2
公开(公告)日：2016-06-21
申请号：US14295367
申请日：2014-06-04
Applicant: Samtec, Inc.
Inventor： Eric Zbinden , Randall Musser , Jean-Marc André Verdiell , John Mongold , Brian Vicich , Keith Guetig
IPC: G02B6/42 , H04B10/40 , H04B1/3827
CPC classification number: G02B6/4284 , G02B6/4232 , G02B6/4246 , G02B6/4249 , G02B6/4261 , G02B6/4269 , G02B6/4278 , G02B6/4279 , G02B6/428 , G02B6/4292 , G02B6/4293 , H01L2224/48091 , H01L2224/49175 , H01R12/716 , H01R13/639 , H04B1/3833 , H04B10/2504 , H04B10/27 , H04B10/40 , H04B10/801 , H04B10/803 , H05K7/20418 , H01L2924/00014
Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
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公开(公告)号：US08588562B2
公开(公告)日：2013-11-19
申请号：US13758464
申请日：2013-02-04
Applicant: Samtec, Inc.
Inventor： Eric Zbinden , Randall Musser , Jean-Marc André Verdiell , John Mongold , Brian Vicich , Keith Guetig
IPC: G02B6/12
CPC classification number: G02B6/4284 , G02B6/4232 , G02B6/4246 , G02B6/4249 , G02B6/4261 , G02B6/4269 , G02B6/4278 , G02B6/4279 , G02B6/428 , G02B6/4292 , G02B6/4293 , H01L2224/48091 , H01L2224/49175 , H01R12/716 , H01R13/639 , H04B1/3833 , H04B10/2504 , H04B10/27 , H04B10/40 , H04B10/801 , H04B10/803 , H05K7/20418 , H01L2924/00014
Abstract: An interconnect system including a host circuit board; an IC package connected to the host circuit board and including a first connector, an IC circuit board, and an IC die; and a transceiver arranged to mate with the first connector so that at least some electrical signals transmitted to and from the IC die are transmitted only on or through the IC circuit board.
Abstract translation: 一种互连系统，包括主机电路板; 连接到主机电路板并包括第一连接器，IC电路板和IC管芯的IC封装; 以及收发器，布置成与第一连接器配合，使得至少一些传输到IC芯片的电信号仅在IC电路板上或通过IC电路板传输。
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公开(公告)号：US11735844B2
公开(公告)日：2023-08-22
申请号：US17496558
申请日：2021-10-07
Applicant: SAMTEC INC.
Inventor： Liam Parkes , Eric Zbinden , Keith Guetig , Jignesh H. Shah , Jean Karlo Williams Barnett , Chadrick Paul Faith , R. Brad Bettman
IPC: H01R12/70 , G02B6/42 , H01R12/77 , H01R12/83 , H01R13/639 , H01R13/629
CPC classification number: H01R12/7029 , G02B6/4246 , G02B6/4269 , G02B6/4277 , H01R12/7058 , H01R12/774 , H01R12/83 , H01R13/629 , H01R13/639
Abstract: An interconnect system includes various anti-backout latches that are movable between an engaged position and a disengaged position. When in the engaged position, the anti-backout latches can be configured to prevent an interconnect module, such as an optical transceiver, from becoming unmated from a host module. When in the disengaged position, the anti-backout latches permit the interconnect module to become unmated from a host module. Securement members are also disclosed that secure a heat sink to a module housing of the interconnect module.
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