公开(公告)号：US20250132527A1

公开(公告)日：2025-04-24

申请号：US19007866

申请日：2025-01-02

Applicant: SAMTEC, INC.

Inventor： Jonathan E. Buck ,  Brandon Thomas Gore ,  Yasuo Sasaki ,  Julian J. Ferry

IPC: H01R13/6599 ,  H01R12/75 ,  H01R13/6471 ,  H01R13/6587

Abstract: An electrical contact for an electrical connector includes a contact body and a lossy material located on the contact body. An electrical connector includes contacts with a lossy material located on the contact body. A method of applying a lossy material to a contact for an electrical connector includes providing a contact and applying the lossy material to the contact.

公开(公告)号：US12278441B2

公开(公告)日：2025-04-15

申请号：US17273364

申请日：2019-09-04

Applicant: SAMTEC, INC.

Inventor： Marc Epitaux ,  Eric J. Zbinden ,  John Coronati ,  Jignesh H. Shah ,  Brandon Thomas Gore

IPC: H01R12/73 ,  G02B6/42 ,  H01L23/498 ,  H01L25/18 ,  H01R12/62 ,  H01R12/72 ,  H01R13/506 ,  H01R13/631 ,  H05K1/11 ,  H05K1/18

Abstract: This present disclosure increases the interconnect density by using a different technology approach than the industry is currently using (stamping and molding). By using a MEMS-based technology approach, better geometry and impedance control can be carried out to reduce impedance discontinuities and feature size. Additional concepts include low connector insertion force, no contact wiping, and a precise alignment mechanism between the connector contacts and those on the mating substrate.

公开(公告)号：US20250070009A1

公开(公告)日：2025-02-27

申请号：US18725120

申请日：2022-12-27

Applicant: MEDTRONIC, INC. ,  Samtec, Inc.

Inventor： Caian Qiu ,  David A. Ruben ,  Neha M. Patel ,  Patrick W. Kinzie ,  Ramiro Garcia ,  Tom Hammann ,  Chris Bohn

IPC: H01L23/498 ,  H01L21/48

Abstract: Various embodiments of an electrical component and a method of forming such electrical component are disclosed. The electrical component includes a substrate and one or more corrosion-resistant vias. The substrate includes ceramic or sapphire. Each of the one or more corrosion-resistant vias includes one or more sidewalls formed by the substrate a corrosion-resistant alloy bonded to the one or more sidewalls.

公开(公告)号：US12218466B2

公开(公告)日：2025-02-04

申请号：US17438222

申请日：2020-03-11

Applicant: SAMTEC, INC.

Inventor： Clarence L. Clyatt, III ,  Travis Ellis

IPC: H01R24/44 ,  H01R13/24 ,  H01R13/631 ,  H01R12/71

Abstract: A radio frequency (RF) electrical contact includes an electrical contact having a stationary electrical contact member and a movable electrical contact member that is received by the stationary electrical contact member. The movable electrical contact member is movable between an initial position and a mated position. The movable electrical contact member can contact the stationary electrical contact member at a stationary or fixed contact location.

公开(公告)号：US20240402446A1

公开(公告)日：2024-12-05

申请号：US18804721

申请日：2024-08-14

Applicant: Samtec, Inc.

Inventor： Eric J. ZBINDEN ,  Randall E. MUSSER ,  Jean-Marc A. VERDIELL ,  John A. MONGOLD ,  Brian R. VICICH ,  Keith R. GUETIG

IPC: G02B6/42 ,  H01R12/71 ,  H01R13/639 ,  H04B1/3827 ,  H04B10/25 ,  H04B10/27 ,  H04B10/40 ,  H04B10/80 ,  H05K7/20

Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.

公开(公告)号：USD1045804S1

公开(公告)日：2024-10-08

申请号：US29832052

申请日：2022-03-24

Applicant: Samtec, Inc.

Designer： Randall E. Musser ,  Jonathan E. Buck

Abstract: This application is related to U.S. patent application Ser. No. 29/821,508 filed on Dec. 30, 2021, and is related to U.S. patent application Ser. No. 29/821,509 filed on Dec. 30, 2021. The entire contents of each application, including the specification, drawings, and appendices, are hereby incorporated by reference.
FIG. 1 is a top, front, and left side perspective view of a connector showing our new design;
FIG. 2 is a top, back, and right side perspective view thereof;
FIG. 3 is a top, back, and right side perspective view thereof;
FIG. 4 is a bottom, front, and right side perspective view thereof;
FIG. 5 is a front side view thereof;
FIG. 6 is a back side view thereof;
FIG. 7 is a right view thereof;
FIG. 8 is a left plan view thereof;
FIG. 9 is a top view thereof; and,
FIG. 10 is a bottom view thereof.
The dash-dash broken lines in the drawings are for the purpose of illustrating portions of the connector that form no part of the claimed design. The dash-dot-dash broken lines in the drawings show a symbolic break in the length of connector. The appearance of any portion of the connector between the break lines forms no part of the claimed design.

公开(公告)号：US12087989B2

公开(公告)日：2024-09-10

申请号：US17611422

申请日：2020-05-14

Applicant: SAMTEC, INC.

Inventor： Marc Epitaux ,  Shashi Chuganey ,  Kelly Garrison ,  Thomas Albert Hall, III ,  Cindy Lee Diegel ,  James Alexander Moss ,  Francisco Noyola ,  Yasuo Sasaki ,  Scott Mcmorrow

IPC: H01P5/08 ,  H01P1/04 ,  H01P3/16

CPC classification number: H01P5/087 ,  H01P1/042 ,  H01P3/16

Abstract: Radio frequency (RF) waveguides and related interconnect members are disclosed. The interconnect members can have a smaller footprint than WR15 flanges. Further, the interconnect members can be configured to mate with complementary interconnects without undergoing substantial relative rotation.

公开(公告)号：US12055771B2

公开(公告)日：2024-08-06

申请号：US18122166

申请日：2023-03-16

Applicant: Samtec, Inc.

Inventor： Jignesh H. Shah ,  William J. Kozlovsky ,  David A. Langsam ,  Raymond J. Lee ,  R. Brad Bettman ,  Eric Jean Zbinden

IPC: G02B6/42

CPC classification number: G02B6/4206 ,  G02B6/4214 ,  G02B6/4246 ,  G02B6/4257

Abstract: An optical block includes a first surface that receives light entering the optical block, a second surface through which the light exits the optical block, and a reflector that reflects light from the first surface towards the second surface. The reflector includes a textured surface that scatters or absorbs some of the light received from the first surface to attenuate the light exiting the optical block through the second surface.

公开(公告)号：US12021324B2

公开(公告)日：2024-06-25

申请号：US18096605

申请日：2023-01-13

Applicant: Samtec, Inc.

Inventor： John A. Mongold ,  Jonathan E. Buck ,  Jignesh H. Shah ,  Chadrick P. Faith ,  Randall E. Musser ,  Jean Karlo Williams Barnet ,  Norman S. McMorrow

IPC: H01R12/79 ,  H01R13/518

CPC classification number: H01R12/79 ,  H01R13/518

Abstract: A cable connector system can include a board connector that attaches to a die package, a cable connector that attaches to the board connector, and a 1RU panel I/O connector attached to the cable connector.

公开(公告)号：US20230156953A1

公开(公告)日：2023-05-18

申请号：US17917659

申请日：2021-04-07

Applicant: Samtec, Inc.

Inventor： Burrell G. BEST ,  Brian R. VICICH ,  Kevin R. MEREDITH ,  Chadrick P. FAITH ,  Istvan NOVAK ,  Jonathan E. BUCK

IPC: H05K7/14 ,  H05K9/00 ,  H01F27/36 ,  H05K1/02 ,  H01R12/73 ,  H01R12/72

CPC classification number: H05K7/1461 ,  H05K9/0018 ,  H01F27/36 ,  H05K1/0209 ,  H01R12/737 ,  H01R12/721

Abstract: A substrate reinforcement or stiffener can be toolless, slide-on, slide-off, and removable. A hold down can carry pre-attached solder balls, solder units, or fusible elements. Fusible elements can be shaped to reduce thermal and mechanical stresses when reflowed onto a substrate. A heat-producing article can include a heat-dissipation material selectively located on, or immediately adjacent to, a heat-producing article. Clips with a plurality of fingers can be added to power conductors. Graphene strips, graphene coatings, or nanomaterials can be applied to electrically non-conductive articles and are able to selectively direct unwanted heat away from the heat-producing article. Electro-magnetic interference can be reduced by selective placement of voids in a shield of an electrical component.