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公开(公告)号:US12055771B2
公开(公告)日:2024-08-06
申请号:US18122166
申请日:2023-03-16
Applicant: Samtec, Inc.
Inventor: Jignesh H. Shah , William J. Kozlovsky , David A. Langsam , Raymond J. Lee , R. Brad Bettman , Eric Jean Zbinden
IPC: G02B6/42
CPC classification number: G02B6/4206 , G02B6/4214 , G02B6/4246 , G02B6/4257
Abstract: An optical block includes a first surface that receives light entering the optical block, a second surface through which the light exits the optical block, and a reflector that reflects light from the first surface towards the second surface. The reflector includes a textured surface that scatters or absorbs some of the light received from the first surface to attenuate the light exiting the optical block through the second surface.
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公开(公告)号:US20220029323A1
公开(公告)日:2022-01-27
申请号:US17496558
申请日:2021-10-07
Applicant: SAMTEC INC.
Inventor: Liam PARKES , Eric ZBINDEN , Keith Guetig , Jignesh H. Shah , Jean Karlo Williams Barnett , Chadrick Paul Faith , R. Brad Bettman
IPC: H01R12/70 , G02B6/42 , H01R12/77 , H01R12/83 , H01R13/639
Abstract: An interconnect system includes various anti-backout latches that are movable between an engaged position and a disengaged position. When in the engaged position, the anti-backout latches can be configured to prevent an interconnect module, such as an optical transceiver, from becoming unmated from a host module. When in the disengaged position, the anti-backout latches permit the interconnect module to become unmated from a host module. Securement members are also disclosed that secure a heat sink to a module housing of the interconnect module.
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公开(公告)号:US11171432B2
公开(公告)日:2021-11-09
申请号:US16325456
申请日:2017-08-15
Applicant: SAMTEC INC.
Inventor: Liam Parkes , Eric Zbinden , Keith Guetig , Jignesh H. Shah , Jean Karlo Williams Barnett , Chadrick Paul Faith , R. Brad Bettman
IPC: H01R12/70 , G02B6/42 , H01R12/77 , H01R12/83 , H01R13/639
Abstract: An interconnect system includes various anti-backout latches that are movable between an engaged position and a disengaged position. When in the engaged position, the anti-backout latches can be configured to prevent an interconnect module, such as an optical transceiver, from becoming unmated from a host module. When in the disengaged position, the anti-backout latches permit the interconnect module to become unmated from a host module. Securement members are also disclosed that secure a heat sink to a module housing of the interconnect module.
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公开(公告)号:US11693194B2
公开(公告)日:2023-07-04
申请号:US17104319
申请日:2020-11-25
Applicant: Samtec, Inc.
Inventor: Jignesh H. Shah , William J. Kozlovsky , David A. Langsam , Raymond J. Lee , R. Brad Bettman , Eric Jean Zbinden
IPC: G02B6/42
CPC classification number: G02B6/4206 , G02B6/4214 , G02B6/4257
Abstract: An optical block includes a first surface that receives light entering the optical block, a second surface through which the light exits the optical block, and a reflector that reflects light from the first surface towards the second surface. The reflector includes a textured surface that scatters or absorbs some of the light received from the first surface to attenuate the light exiting the optical block through the second surface.
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公开(公告)号:US12253725B2
公开(公告)日:2025-03-18
申请号:US17424052
申请日:2020-01-17
Applicant: SAMTEC, INC.
Inventor: Matthew Brian Puffer , Raymond Lee , R. Brad Bettman , Edwin Loy , Dyan Seville-Jones , Arlon Martin , Stephen Michael Girlando , Christopher Alan Bandfield
IPC: G02B6/42
Abstract: This present disclosure seals the light propagation path in an optical interconnection element from external contaminants. The optical interconnection element includes a reflective surface, which can also be sealed from external contaminants Additional novel concepts include all enclosed sealed regions of the optical interconnection element being fluidly connected and making the final seal of the optical interconnection element with a thin plate, which can bend reducing the pressure differential between the ambient environment and the sealed internal volume of the optical interconnection element.
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公开(公告)号:US11735844B2
公开(公告)日:2023-08-22
申请号:US17496558
申请日:2021-10-07
Applicant: SAMTEC INC.
Inventor: Liam Parkes , Eric Zbinden , Keith Guetig , Jignesh H. Shah , Jean Karlo Williams Barnett , Chadrick Paul Faith , R. Brad Bettman
IPC: H01R12/70 , G02B6/42 , H01R12/77 , H01R12/83 , H01R13/639 , H01R13/629
CPC classification number: H01R12/7029 , G02B6/4246 , G02B6/4269 , G02B6/4277 , H01R12/7058 , H01R12/774 , H01R12/83 , H01R13/629 , H01R13/639
Abstract: An interconnect system includes various anti-backout latches that are movable between an engaged position and a disengaged position. When in the engaged position, the anti-backout latches can be configured to prevent an interconnect module, such as an optical transceiver, from becoming unmated from a host module. When in the disengaged position, the anti-backout latches permit the interconnect module to become unmated from a host module. Securement members are also disclosed that secure a heat sink to a module housing of the interconnect module.
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公开(公告)号:US11196195B2
公开(公告)日:2021-12-07
申请号:US16604023
申请日:2018-04-10
Applicant: SAMTEC, INC.
Inventor: R. Brad Bettman , Liam Parkes , Eric Zbinden , Keith Guetig , Jignesh H. Shah , Jean Karlo Williams Barnett , Chadrick Paul Faith , Edwin Loy
Abstract: Interconnect systems having anti-backout latches and securement members are disclosed.
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公开(公告)号:US10884198B2
公开(公告)日:2021-01-05
申请号:US15078162
申请日:2016-03-23
Applicant: Samtec, Inc.
Inventor: Jignesh H. Shah , William J. Kozlovsky , David A. Langsam , Raymond J. Lee , R. Brad Bettman , Eric Jean Zbinden
IPC: G02B6/42
Abstract: An optical block includes a first surface that receives light entering the optical block, a second surface through which the light exits the optical block, and a reflector that reflects light from the first surface towards the second surface. The reflector includes a textured surface that scatters or absorbs some of the light received from the first surface to attenuate the light exiting the optical block through the second surface.
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公开(公告)号:USD822611S1
公开(公告)日:2018-07-10
申请号:US29604016
申请日:2017-05-15
Applicant: Samtec, Inc.
Designer: R. Brad Bettman , Jean Karlo Williams Barnett , Jignesh H. Shah
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