Invention Grant
- Patent Title: Output buffer circuit with metal option
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Application No.: US16800899Application Date: 2020-02-25
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Publication No.: US11183232B2Publication Date: 2021-11-23
- Inventor: Toshiaki Tsukihashi , Kenichi Watanabe , Kazuyuki Morishige , Moeha Shibuya , Kumiko Ishii
- Applicant: MICRON TECHNOLOGY, INC.
- Applicant Address: US ID Boise
- Assignee: MICRON TECHNOLOGY, INC.
- Current Assignee: MICRON TECHNOLOGY, INC.
- Current Assignee Address: US ID Boise
- Agency: Dorsey & Whitney LLP
- Main IPC: G06F1/16
- IPC: G06F1/16 ; G11C11/4093 ; H01L27/108

Abstract:
Disclosed herein is an apparatus that includes: first and second wiring patterns extending in a first direction, first and second transistors arranged adjacent to each other, and third to sixth wiring patterns extending in a second direction. The third wiring pattern is connected between the first wiring pattern and one of source/drain regions of the first transistor, the fourth wiring pattern is connected between the second wiring pattern and other of source/drain regions of the first transistor, the fifth wiring pattern is connected to one of source/drain regions of the second transistor, the fifth wiring pattern overlapping with the first wiring pattern, the sixth wiring pattern is connected to other of source/drain regions of the second transistor, the sixth wiring pattern overlapping with the second wiring pattern. The third and fourth wiring patterns are greater in width in the first direction than the fifth and sixth wiring patterns.
Public/Granted literature
- US20210264967A1 OUTPUT BUFFER CIRCUIT WITH METAL OPTION Public/Granted day:2021-08-26
Information query