Invention Grant
- Patent Title: Endpointing detection for chemical mechanical polishing based on spectrometry
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Application No.: US16397870Application Date: 2019-04-29
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Publication No.: US11183435B2Publication Date: 2021-11-23
- Inventor: Dominic J. Benvegnu , Jeffrey Drue David , Boguslaw A. Swedek
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson P.C.
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L21/67 ; H01L21/306 ; H01L21/3105 ; H01L21/321 ; B24B37/013 ; B24D7/14 ; B24B49/12 ; B24B49/08 ; B24B37/20
Abstract:
A method of detecting a polishing endpoint includes storing a plurality of library spectra, measuring a sequence of spectra from the substrate in-situ during polishing, and for each measured spectrum of the sequence of spectra, finding a best matching library spectrum from the plurality of library spectra to generate a sequence of best matching library spectra. Each library spectrum has a stored associated value representing a degree of progress through a polishing process, and the stored associated value for the best matching library spectrum is determined for each best matching library spectrum to generate a sequence of values representing a progression of polishing of the substrate. The sequence of values is compared to a target value, and a polishing endpoint is triggered when the sequence of values reaches the target value.
Public/Granted literature
- US20190252274A1 ENDPOINTING DETECTION FOR CHEMICAL MECHANICAL POLISHING BASED ON SPECTROMETRY Public/Granted day:2019-08-15
Information query
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