Invention Grant
- Patent Title: Integrated microphone device and manufacturing method thereof
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Application No.: US16813923Application Date: 2020-03-10
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Publication No.: US11184694B2Publication Date: 2021-11-23
- Inventor: Chun-Wen Cheng , Chia-Hua Chu , Chun-Yin Tsai , Tzu-Heng Wu , Wen-Cheng Kuo
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H04R1/08
- IPC: H04R1/08 ; H04R19/00 ; H04R19/04 ; H04R31/00

Abstract:
An integrated microphone device is provided. The integrated microphone device includes a substrate, a plate, and a membrane. The substrate includes an aperture allowing acoustic pressure to pass through. The plate is disposed on a side of the substrate. The membrane is disposed between the substrate and the plate and movable relative to the plate as acoustic pressure strikes the membrane. The membrane includes a vent valve having an open area that is variable in response to a change in acoustic pressure.
Public/Granted literature
- US20200213701A1 INTEGRATED MICROPHONE DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2020-07-02
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