Invention Grant
- Patent Title: Method of supplying electrical power from rigid printed circuit board to another rigid printed circuit board in rigid-flex printed circuit board array
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Application No.: US16055117Application Date: 2018-08-05
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Publication No.: US11184981B2Publication Date: 2021-11-23
- Inventor: Richard K Williams , Keng Hung Lin
- Applicant: Applied BioPhotonics, Ltd.
- Applicant Address: CN Hong Kong
- Assignee: Applied BioPhotonics, Ltd.
- Current Assignee: Applied BioPhotonics, Ltd.
- Current Assignee Address: CN Hong Kong
- Agent David E. Steuber
- Main IPC: H05K3/02
- IPC: H05K3/02 ; H05K3/10 ; H05K1/14 ; H05K3/46 ; H05K3/00 ; H05K3/06 ; H05K3/18 ; H05K3/32 ; H05K3/36 ; H05K3/40 ; H05K3/24

Abstract:
A rigid-flex PCB includes an array of rigid PCB “islands” interconnected by a flexible PCB formed into flexible connectors. The conductive and insulating layers of the flexible PCB extend into the rigid PCBs, giving the electrical connections to the rigid PCBs added resistance to breakage as the rigid-flex PCB is repeatedly stressed by bending and twisting forces. In addition, the durability of the rigid-flex PCB is enhanced by making the power and signal lines driving the rigid PCBs redundant so that a breakage of a line will not necessarily affect the operation of the rigid PCB to which it is attached. The rigid-flex PCB is particularly applicable to light pads used in phototherapy, wherein LEDs mounted on the rigid-PCBs are powered and controlled through the redundant lines in the flexible PCB.
Public/Granted literature
- US20180343741A1 Method Of Fabricating 3D Bendable Printed Circuit Board Public/Granted day:2018-11-29
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