Modular power delivery techniques for electronic devices are described. In one embodiment, an apparatus may comprise native power delivery circuitry to source a native power delivery current, power management circuitry to control the native power delivery circuitry, a power delivery connector to mate with a counterpart power delivery connector of an external device, and a processing device conductively coupled to the power delivery connector via a supplemental power delivery line, the processing device to draw a supplemental power delivery current from the external device via the supplemental power delivery line. Other embodiments are described and claimed.