公开(公告)号：USD941333S1

公开(公告)日：2022-01-18

申请号：US29748021

申请日：2020-08-26

Applicant: Intel Corporation

Designer： Chunlin Bai ,  Celia H. Yang ,  Yiming He ,  Lunkai Zou ,  Maojun Li

公开(公告)号：US11188132B2

公开(公告)日：2021-11-30

申请号：US15169350

申请日：2016-05-31

Applicant: INTEL CORPORATION

Inventor： Yu Liang Shiao ,  Tawfik M. Rahal-Arabi ,  Chang-Wu Yen ,  Celia H. Yang

IPC: G06F1/26 ,  G05F3/02 ,  G06F1/28

Abstract: Modular power delivery techniques for electronic devices are described. In one embodiment, an apparatus may comprise native power delivery circuitry to source a native power delivery current, power management circuitry to control the native power delivery circuitry, a power delivery connector to mate with a counterpart power delivery connector of an external device, and a processing device conductively coupled to the power delivery connector via a supplemental power delivery line, the processing device to draw a supplemental power delivery current from the external device via the supplemental power delivery line. Other embodiments are described and claimed.