公开(公告)号：US11188132B2

公开(公告)日：2021-11-30

申请号：US15169350

申请日：2016-05-31

Applicant: INTEL CORPORATION

Inventor： Yu Liang Shiao ,  Tawfik M. Rahal-Arabi ,  Chang-Wu Yen ,  Celia H. Yang

IPC: G06F1/26 ,  G05F3/02 ,  G06F1/28

Abstract: Modular power delivery techniques for electronic devices are described. In one embodiment, an apparatus may comprise native power delivery circuitry to source a native power delivery current, power management circuitry to control the native power delivery circuitry, a power delivery connector to mate with a counterpart power delivery connector of an external device, and a processing device conductively coupled to the power delivery connector via a supplemental power delivery line, the processing device to draw a supplemental power delivery current from the external device via the supplemental power delivery line. Other embodiments are described and claimed.

公开(公告)号：US10462274B2

公开(公告)日：2019-10-29

申请号：US15777137

申请日：2015-12-26

Applicant: INTEL CORPORATION

Inventor： Moss Weng ,  Alesi Hung ,  Chang-Wu Yen ,  Ching-Shan Cheng

IPC: H04M1/02 ,  H05K7/14 ,  H05K7/20 ,  G06F1/20

Abstract: Embodiments are generally directed to an adjustable gap structure for mobile devices. An embodiment of a mobile device includes a cover; a printed circuit board including a processing component and thermal solution, the printed circuit board being movable along a first axis towards or away from the cover to provide an adjustable air gap; one or more ferromagnetic elements coupled with the printed circuit board; and one or more magnets, wherein, in first mode, the one or more magnets are to attract the one or more ferromagnetic elements and maintain an air gap of a first distance between the thermal solution and the cover, and wherein, in a second mode, an external magnetic force is to pull the ferromagnetic elements away from the one or more magnets and reduce the air gap between the thermal solution and the cover.

公开(公告)号：US10401931B2

公开(公告)日：2019-09-03

申请号：US14978278

申请日：2015-12-22

Applicant: Intel Corporation

Inventor： Jimmy Y. Hsiao ,  Tawfik M. Rhal-Arabi ,  Chang-Wu Yen

IPC: G06F1/00 ,  G06F1/26 ,  G06F1/32 ,  G06F13/40 ,  G06F1/16

Abstract: A power delivery architecture for a computing system is described. In one embodiment, an apparatus comprises a docking station; and a computing system removably coupled to the docking station and having a plurality of components and a power delivery subsystem to deliver power to integrated circuit (IC) components under direction of a controller, where the controller is communicably coupled to the docking station when the docking station is coupled to the computing system to cause power from the docking station to be delivered to at least one of the components with power from the power delivery system.

公开(公告)号：US20170177049A1

公开(公告)日：2017-06-22

申请号：US14978278

申请日：2015-12-22

Applicant: Intel Corporation

Inventor： Jimmy Y. Hsiao ,  Tawfik M. Rhal-Arabi ,  Chang-Wu Yen

IPC: G06F1/26 ,  G06F13/40

CPC classification number: G06F1/266 ,  G06F1/1632 ,  G06F1/263 ,  G06F13/4081

Abstract: A power delivery architecture for a computing system is described. In one embodiment, an apparatus comprises a docking station; and a computing system removably coupled to the docking station and having a plurality of components and a power delivery subsystem to deliver power to integrated circuit (IC) components under direction of a controller, where the controller is communicably coupled to the docking station when the docking station is coupled to the computing system to cause power from the docking station to be delivered to at least one of the components with power from the power delivery system.