Invention Grant
- Patent Title: System-in-package network processors
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Application No.: US16369889Application Date: 2019-03-29
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Publication No.: US11190460B2Publication Date: 2021-11-30
- Inventor: Kevin Clark , Scott J. Weber , Ravi Prakash Gutala , Aravind Raghavendra Dasu
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Fletcher Yoder, P.C.
- Main IPC: H04L12/933
- IPC: H04L12/933 ; H01L25/065 ; H01L23/538

Abstract:
This disclosure relates to integrated circuit devices that may include a network processor in a data processing die and an on-package memory in a base die. The data processing die may implement one or more network functionalities that may exchange data with low-latency memory, high capacity in the base die. The data processing die may be programmable fabric, which may be dynamically reconfigured during operation.
Public/Granted literature
- US20190230049A1 SYSTEM-IN-PACKAGE NETWORK PROCESSORS Public/Granted day:2019-07-25
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