MULTI-PURPOSE INTERFACE FOR CONFIGURATION DATA AND USER FABRIC DATA

    公开(公告)号:US20190140648A1

    公开(公告)日:2019-05-09

    申请号:US16235984

    申请日:2018-12-28

    申请人: Intel Corporation

    摘要: An integrated circuit device may include a programmable fabric die having programmable logic fabric and configuration memory that may configure the programmable logic fabric. The integrated circuit device may also include a base die that may provide fabric support circuitry, including memory and/or communication interfaces. The first die and the second die may be coupled using a multi-purpose interface that may allow communication between the first die and the second die. The multi-purpose interface may allow concurrent access to the base die by the programmable logic fabric and the configuration memory by using multiple channels over the multi-purpose interface.

    Sector-Aligned Memory Accessible to Programmable Logic Fabric of Programmable Logic Device

    公开(公告)号:US20190043536A1

    公开(公告)日:2019-02-07

    申请号:US15868304

    申请日:2018-01-11

    申请人: Intel Corporation

    IPC分类号: G11C5/02 G11C5/06 H03K19/177

    摘要: An integrated circuit device may include programmable logic fabric on a first integrated circuit die and sector-aligned memory on a second integrated circuit die to enable large amounts of data to be rapidly processed by a sector of programmable logic of the programmable logic device. The programmable logic fabric may include a first and second sectors. The first sector may be programmed with a circuit design that operates on a first set of data. The sector-aligned memory may include a first sector of sector-aligned memory directly accessible by the first sector of programmable logic fabric and a second sector of sector-aligned memory directly accessible by the second sector of programmable logic fabric. The first sector of sector-aligned memory may store the first set of data.

    FAST MEMORY FOR PROGRAMMABLE DEVICES

    公开(公告)号:US20210384912A1

    公开(公告)日:2021-12-09

    申请号:US17407700

    申请日:2021-08-20

    申请人: Intel Corporation

    摘要: An integrated circuit device may include a programmable fabric die having programmable logic fabric and configuration memory that may configure the programmable logic fabric. The integrated circuit device may also include a base die that may provide fabric support circuitry, including memory and/or communication interfaces as well as compute elements that may also be application-specific. The memory in the base die may be directly accessed by the programmable fabric die using a low-latency, high capacity, and high bandwidth interface.

    Dynamic deep learning processor architecture

    公开(公告)号:US11442889B2

    公开(公告)日:2022-09-13

    申请号:US16146886

    申请日:2018-09-28

    申请人: Intel Corporation

    摘要: Methods and systems for dynamically reconfiguring a deep learning processor by operating the deep learning processor using a first configuration. The deep learning processor then tracking one or more parameters of a deep learning program executed using the deep learning processor in the first configuration. The deep learning processor then reconfigures the deep learning processor to a second configuration to enhance efficiency of the deep learning processor executing the deep learning program based at least in part on the one or more parameters.