公开(公告)号：US12273282B2

公开(公告)日：2025-04-08

申请号：US18587744

申请日：2024-02-26

Applicant: Intel Corporation

Inventor： Kevin Clark ,  Scott J. Weber ,  Ravi Prakash Gutala ,  Aravind Raghavendra Dasu

IPC: H04L49/109 ,  H01L23/538 ,  H01L25/065 ,  H04L49/15

Abstract: This disclosure relates to integrated circuit devices that may include a network processor in a data processing die and an on-package memory in a base die. The data processing die may implement one or more network functionalities that may exchange data with low-latency memory, high capacity in the base die. The data processing die may be programmable fabric, which may be dynamically reconfigured during operation.

公开(公告)号：US11611518B2

公开(公告)日：2023-03-21

申请号：US17528005

申请日：2021-11-16

Applicant: Intel Corporation

Inventor： Kevin Clark ,  Scott J. Weber ,  Ravi Prakash Gutala ,  Aravind Raghavendra Dasu

IPC: H01L25/065 ,  H04L12/933 ,  H04L49/109 ,  H04L49/15 ,  H01L23/538

Abstract: This disclosure relates to integrated circuit devices that may include a network processor in a data processing die and an on-package memory in a base die. The data processing die may implement one or more network functionalities that may exchange data with low-latency memory, high capacity in the base die. The data processing die may be programmable fabric, which may be dynamically reconfigured during operation.

公开(公告)号：US20230056118A1

公开(公告)日：2023-02-23

申请号：US17893004

申请日：2022-08-22

Applicant: Intel Corporation

Inventor： Kevin Clark ,  Scott J. Weber ,  James Ball ,  Ravi Prakash Gutala ,  Aravind Raghavendra Dasu

IPC: H03K19/1776 ,  G11C7/10 ,  H01L25/065 ,  G11C5/02

Abstract: An integrated circuit device may include a programmable fabric die having programmable logic fabric and configuration memory that may configure the programmable logic fabric. The integrated circuit device may also include a base die that may provide fabric support circuitry, including memory and/or communication interfaces. The first die and the second die may be coupled using a multi-purpose interface that may allow communication between the first die and the second die. The multi-purpose interface may allow concurrent access to the base die by the programmable logic fabric and the configuration memory by using multiple channels over the multi-purpose interface.

公开(公告)号：US20220078136A1

公开(公告)日：2022-03-10

申请号：US17528005

申请日：2021-11-16

Applicant: Intel Corporation

Inventor： Kevin Clark ,  Scott J. Weber ,  Ravi Prakash Gutala ,  Aravind Raghavendra Dasu

IPC: H04L12/933 ,  H01L25/065

Abstract: This disclosure relates to integrated circuit devices that may include a network processor in a data processing die and an on-package memory in a base die. The data processing die may implement one or more network functionalities that may exchange data with low-latency memory, high capacity in the base die. The data processing die may be programmable fabric, which may be dynamically reconfigured during operation.

公开(公告)号：US11190460B2

公开(公告)日：2021-11-30

申请号：US16369889

申请日：2019-03-29

Applicant: Intel Corporation

Inventor： Kevin Clark ,  Scott J. Weber ,  Ravi Prakash Gutala ,  Aravind Raghavendra Dasu

IPC: H04L12/933 ,  H01L25/065 ,  H01L23/538

Abstract: This disclosure relates to integrated circuit devices that may include a network processor in a data processing die and an on-package memory in a base die. The data processing die may implement one or more network functionalities that may exchange data with low-latency memory, high capacity in the base die. The data processing die may be programmable fabric, which may be dynamically reconfigured during operation.

公开(公告)号：US11424744B2

公开(公告)日：2022-08-23

申请号：US17094612

申请日：2020-11-10

Applicant: Intel Corporation

Inventor： Kevin Clark ,  Scott J. Weber ,  James Ball ,  Ravi Prakash Gutala ,  Aravind Raghavendra Dasu

IPC: H03K19/1776 ,  G11C5/02 ,  G11C7/10 ,  H01L25/065

Abstract: An integrated circuit device may include a programmable fabric die having programmable logic fabric and configuration memory that may configure the programmable logic fabric. The integrated circuit device may also include a base die that may provide fabric support circuitry, including memory and/or communication interfaces. The first die and the second die may be coupled using a multi-purpose interface that may allow communication between the first die and the second die. The multi-purpose interface may allow concurrent access to the base die by the programmable logic fabric and the configuration memory by using multiple channels over the multi-purpose interface.

公开(公告)号：US11223361B2

公开(公告)日：2022-01-11

申请号：US16882029

申请日：2020-05-22

Applicant: Intel Corporation

Inventor： Kevin Clark ,  Scott J. Weber ,  James Ball ,  Simon Chong ,  Ravi Prakash Gutala ,  Aravind Raghavendra Dasu ,  Jun Pin Tan

IPC: H03K19/1776 ,  H03K19/17704 ,  H03K19/17758 ,  H03K19/17768

Abstract: An integrated circuit device may include programmable logic fabric disposed on a first integrated circuit die and having configuration memory. The integrated circuit device may also include a base die that may provide memory and/or operating supporting circuitry. The first die and the second die may be coupled using a high-speed parallel interface. The interface may employ microbumps. The first die and the second die may also include controllers for the interface.

公开(公告)号：US20210058085A1

公开(公告)日：2021-02-25

申请号：US17094612

申请日：2020-11-10

Applicant: Intel Corporation

Inventor： Kevin Clark ,  Scott J. Weber ,  James Ball ,  Ravi Prakash Gutala ,  Aravind Raghavendra Dasu

IPC: H03K19/1776 ,  G11C7/10 ,  H01L25/065 ,  G11C5/02

Abstract: An integrated circuit device may include a programmable fabric die having programmable logic fabric and configuration memory that may configure the programmable logic fabric. The integrated circuit device may also include a base die that may provide fabric support circuitry, including memory and/or communication interfaces. The first die and the second die may be coupled using a multi-purpose interface that may allow communication between the first die and the second die. The multi-purpose interface may allow concurrent access to the base die by the programmable logic fabric and the configuration memory by using multiple channels over the multi-purpose interface.

公开(公告)号：US10833679B2

公开(公告)日：2020-11-10

申请号：US16235984

申请日：2018-12-28

Applicant: Intel Corporation

Inventor： Kevin Clark ,  Scott J. Weber ,  James Ball ,  Ravi Prakash Gutala ,  Aravind Raghavendra Dasu

IPC: H03K19/177 ,  H01L25/00 ,  H03K19/1776 ,  G11C7/10 ,  H01L25/065 ,  G11C5/02

Abstract: An integrated circuit device may include a programmable fabric die having programmable logic fabric and configuration memory that may configure the programmable logic fabric. The integrated circuit device may also include a base die that may provide fabric support circuitry, including memory and/or communication interfaces. The first die and the second die may be coupled using a multi-purpose interface that may allow communication between the first die and the second die. The multi-purpose interface may allow concurrent access to the base die by the programmable logic fabric and the configuration memory by using multiple channels over the multi-purpose interface.

公开(公告)号：US20190103872A1

公开(公告)日：2019-04-04

申请号：US16146849

申请日：2018-09-28

Applicant: Intel Corporation

Inventor： Kevin Clark ,  Scott J. Weber ,  James Ball ,  Simon Chong ,  Ravi Prakash Gutala ,  Aravind Raghavendra Dasu

IPC: H03K19/177

Abstract: An integrated circuit device may include programmable logic fabric disposed on a first integrated circuit die and having configuration memory. The integrated circuit device may also include a base die that may provide memory and/or operating supporting circuitry. The first die and the second die may be coupled using a high-speed parallel interface. The interface may employ microbumps. The first die and the second die may also include controllers for the interface.