- Patent Title: Handling and processing double-sided devices on fragile substrates
-
Application No.: US16713744Application Date: 2019-12-13
-
Publication No.: US11205978B2Publication Date: 2021-12-21
- Inventor: Wayne McMillan , Visweswaren Sivaramakrishnan , Joseph C. Olson , Ludovic Godet , Rutger Meyer Timmerman Thijssen , Naamah Argaman
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: H02N13/00
- IPC: H02N13/00 ; C23F1/00 ; G02B6/34 ; H01L21/683 ; C23C16/453 ; H05H1/24 ; H01L21/265

Abstract:
Embodiments of the present disclosure generally relate to substrate support assemblies for retaining a surface of a substrate having one or more devices disposed on the surface without contacting the one or more devices and deforming the substrate, and a system having the same. In one embodiment, the substrate support assembly includes an edge ring coupled to a body of the substrate support assembly. A controller is coupled to actuated mechanisms of a plurality of pixels coupled to the body of the substrate support assembly such that portions of pixels corresponding to a portion of the surface of a substrate to be retained are positioned to support the portion without contacting one or more devices disposed on the surface of the substrate to be retained on the support surface.
Information query