公开(公告)号：US12084761B2

公开(公告)日：2024-09-10

申请号：US18111385

申请日：2023-02-17

Applicant: Applied Materials, Inc.

Inventor： Karl J. Armstrong ,  Ludovic Godet ,  Brian Alexander Cohen ,  Wayne McMillan ,  James D. Strassner ,  Benjamin B. Riordon

IPC: H01L21/677 ,  C23C14/04 ,  C23C14/06 ,  C23C14/08 ,  C23C14/14 ,  C23C16/04 ,  C23C16/24 ,  C23C16/34 ,  C23C16/40 ,  C23C16/455 ,  C23C16/56 ,  H01L21/68 ,  H01L21/683 ,  G02B6/132

CPC classification number: C23C16/405 ,  C23C14/042 ,  C23C14/0652 ,  C23C14/083 ,  C23C14/086 ,  C23C14/14 ,  C23C16/042 ,  C23C16/24 ,  C23C16/345 ,  C23C16/407 ,  C23C16/45525 ,  C23C16/56 ,  H01L21/67766 ,  H01L21/67778 ,  H01L21/682 ,  H01L21/6838 ,  G02B6/132

Abstract: Embodiments of the present disclosure relate to forming multi-depth films for the fabrication of optical devices. One embodiment includes disposing a base layer of a device material on a surface of a substrate. One or more mandrels of the device material are disposed on the base layer. The disposing the one or more mandrels includes positioning a mask over of the base layer. The device material is deposited with the mask positioned over the base layer to form an optical device having the base layer with a base layer depth and the one or more mandrels having a first mandrel depth and a second mandrel depth.

公开(公告)号：US11333896B2

公开(公告)日：2022-05-17

申请号：US16454642

申请日：2019-06-27

Applicant: Applied Materials, Inc.

Inventor： Ludovic Godet ,  Wayne McMillan ,  Rutger Meyer Timmerman Thijssen

IPC: G02B27/09 ,  G02B5/18 ,  G03F1/80 ,  G03F7/00

Abstract: The systems and methods discussed herein are for the fabrication of diffraction gratings, such as those gratings used in waveguide combiners. The waveguide combiners discussed herein are fabricated using nanoimprint lithography (NIL) of high-index and low-index materials in combination with and directional etching high-index and low-index materials. The waveguide combiners can be additionally or alternatively formed by the directional etching of transparent substrates. The waveguide combiners that include diffraction gratings discussed herein can be formed directly on permanent transparent substrates. In other examples, the diffraction gratings can be formed on temporary substrates and transferred to a permanent, transparent substrate.

公开(公告)号：US11205978B2

公开(公告)日：2021-12-21

申请号：US16713744

申请日：2019-12-13

Applicant: Applied Materials, Inc.

Inventor： Wayne McMillan ,  Visweswaren Sivaramakrishnan ,  Joseph C. Olson ,  Ludovic Godet ,  Rutger Meyer Timmerman Thijssen ,  Naamah Argaman

IPC: H02N13/00 ,  C23F1/00 ,  G02B6/34 ,  H01L21/683 ,  C23C16/453 ,  H05H1/24 ,  H01L21/265

Abstract: Embodiments of the present disclosure generally relate to substrate support assemblies for retaining a surface of a substrate having one or more devices disposed on the surface without contacting the one or more devices and deforming the substrate, and a system having the same. In one embodiment, the substrate support assembly includes an edge ring coupled to a body of the substrate support assembly. A controller is coupled to actuated mechanisms of a plurality of pixels coupled to the body of the substrate support assembly such that portions of pixels corresponding to a portion of the surface of a substrate to be retained are positioned to support the portion without contacting one or more devices disposed on the surface of the substrate to be retained on the support surface.

公开(公告)号：US11626321B2

公开(公告)日：2023-04-11

申请号：US16882177

申请日：2020-05-22

Applicant: Applied Materials, Inc.

Inventor： Ludovic Godet ,  Wayne McMillan ,  Rutger Meyer Timmerman Thijssen ,  Naamah Argaman ,  Tapashree Roy ,  Sage Toko Garrett Doshay

IPC: H01L21/768 ,  H01L21/3213 ,  H01L21/311 ,  H01L25/04 ,  H01L25/16

Abstract: Systems and methods herein are related to the formation of optical devices including stacked optical element layers using silicon wafers, glass, or devices as substrates. The optical elements discussed herein can be fabricated on temporary or permanent substrates. In some examples, the optical devices are fabricated to include transparent substrates or devices including charge-coupled devices (CCD), or complementary metal-oxide semiconductor (CMOS) image sensors, light-emitting diodes (LED), a micro-LED (uLED) display, organic light-emitting diode (OLED) or vertical-cavity surface-emitting laser (VCSELs). The optical elements can have interlayers formed in between optical element layers, where the interlayers can range in thickness from 1 nm to 3 mm.

公开(公告)号：US11614685B2

公开(公告)日：2023-03-28

申请号：US17545554

申请日：2021-12-08

Applicant: Applied Materials, Inc.

Inventor： Ludovic Godet ,  Chien-An Chen ,  Brian Alexander Cohen ,  Wayne McMillan ,  Ian Matthew McMackin

IPC: G03F7/00 ,  H01L21/311 ,  G02B6/34

Abstract: Methods for patterning of multi-depth layers for the fabrication of optical devices are provided. In one embodiment, a method is provided that includes disposing a resist layer over a device layer disposed over a top surface of a substrate, the device layer having a first portion and a second portion, patterning the resist layer to form a first resist layer pattern having a plurality of first openings and a second resist layer pattern having a plurality of second openings, and etching exposed portions of the device layer defined by the plurality of first openings and the plurality of second openings, wherein the plurality of first openings are configured to form at least a portion of a plurality of first structures within the optical device, and the plurality of second openings are configured to form at least a portion of a plurality of second structures within the optical device.

公开(公告)号：US11662516B2

公开(公告)日：2023-05-30

申请号：US17730280

申请日：2022-04-27

Applicant: Applied Materials, Inc.

Inventor： Michael Yu-tak Young ,  Wayne McMillan ,  Rutger Meyer Timmerman Thijssen ,  Robert Jan Visser

IPC: G03F7/00 ,  H01L21/67 ,  F21V8/00

CPC classification number: G02B6/0065 ,  G02B6/0038 ,  G03F7/0002 ,  G03F7/0005

Abstract: Embodiments described herein relate to methods for fabricating waveguide structures utilizing substrates. The waveguide structures are formed having input coupling regions, waveguide regions, and output coupling regions formed from substrates. The regions are formed by imprinting stamps into resists disposed on hard masks formed on surfaces of the substrates to form positive waveguide patterns. Portions of the positive waveguide patterns and the hard masks formed under the portions are removed. The substrates are masked and etched to form gratings in the input coupling regions and the output coupling regions. Residual portions of the positive waveguide patterns and the hard masks disposed under the residual portions are removed to form waveguide structures having input coupling regions, waveguide regions, and output coupling regions formed from substrates.

公开(公告)号：US11487139B2

公开(公告)日：2022-11-01

申请号：US16601006

申请日：2019-10-14

Applicant: Applied Materials, Inc.

Inventor： Tapashree Roy ,  Wayne McMillan ,  Rutger Meyer Timmerman Thijssen

IPC: G02F1/01 ,  B82Y20/00

Abstract: Embodiments of metasurfaces having nanostructures with desired geometric profiles and configurations are provided in the present disclosure. In one embodiment, a metasurface includes a nanostructure formed on a substrate, wherein the nanostructure is cuboidal or cylindrical in shape. In another embodiment, a metasurface includes a plurality of nanostructures on a substrate, wherein each of the nanostructures has a gap greater than 35 nm spaced apart from each other. In yet another embodiment, a metasurface includes a plurality of nanostructures on a substrate, wherein the nanostructures are fabricated from at least one of TiO2, silicon nitride, or amorphous silicon, or GaN or aluminum zinc oxide or any material with refractive index greater than 1.8, and absorption coefficient smaller than 0.001, the substrate is transparent with absorption coefficient smaller than 0.001.

公开(公告)号：US11327218B2

公开(公告)日：2022-05-10

申请号：US16762869

申请日：2018-11-13

Applicant: Applied Materials, Inc.

Inventor： Michael Yu-tak Young ,  Wayne McMillan ,  Rutger Meyer Timmerman Thijssen ,  Robert Jan Visser

IPC: G03F7/00 ,  B44C1/22 ,  F21V8/00

Abstract: Embodiments described herein relate to methods for fabricating waveguide structures utilizing substrates. The waveguide structures are formed having input coupling regions, waveguide regions, and output coupling regions formed from substrates. The regions are formed by imprinting stamps into resists disposed on hard masks formed on surfaces of the substrates to form positive waveguide patterns. Portions of the positive waveguide patterns and the hard masks formed under the portions are removed. The substrates are masked and etched to form gratings in the input coupling regions and the output coupling regions. Residual portions of the positive waveguide patterns and the hard masks disposed under the residual portions are removed to form waveguide structures having input coupling regions, waveguide regions, and output coupling regions formed from substrates.

公开(公告)号：US11226556B2

公开(公告)日：2022-01-18

申请号：US16844636

申请日：2020-04-09

Applicant: Applied Materials, Inc.

Inventor： Ludovic Godet ,  Chien-An Chen ,  Brian Alexander Cohen ,  Wayne McMillan ,  Ian Matthew McMackin

IPC: G03F7/00 ,  H01L21/311 ,  G02B6/34

Abstract: Methods for patterning of multi-depth layers for the fabrication of optical devices are provided. In one embodiment, a method is provided that includes disposing a resist layer over a device layer disposed over a top surface of a substrate, the device layer having a first portion and a second portion, patterning the resist layer to form a first resist layer pattern having a plurality of first openings and a second resist layer pattern having a plurality of second openings, and etching exposed portions of the device layer defined by the plurality of first openings and the plurality of second openings, wherein the plurality of first openings are configured to form at least a portion of a plurality of first structures within the optical device, and the plurality of second openings are configured to form at least a portion of a plurality of second structures within the optical device.

公开(公告)号：US10707118B2

公开(公告)日：2020-07-07

申请号：US16283560

申请日：2019-02-22

Applicant: Applied Materials, Inc.

Inventor： Ludovic Godet ,  Wayne McMillan ,  Rutger Meyer Timmerman Thijssen ,  Naamah Argaman ,  Tapashree Roy ,  Sage Doshay

IPC: H01L21/768 ,  H01L21/3213 ,  H01L21/311 ,  H01L25/04 ,  H01L25/16

Abstract: Systems and methods herein are related to the formation of optical devices including stacked optical element layers using silicon wafers, glass, or devices as substrates. The optical elements discussed herein can be fabricated on temporary or permanent substrates. In some examples, the optical devices are fabricated to include transparent substrates or devices including charge-coupled devices (CCD), or complementary metal-oxide semiconductor (CMOS) image sensors, light-emitting diodes (LED), a micro-LED (uLED) display, organic light-emitting diode (OLED) or vertical-cavity surface-emitting laser (VCSELs). The optical elements can have interlayers formed in between optical element layers, where the interlayers can range in thickness from 1 nm to 3 mm.