Invention Grant
- Patent Title: Heat treatment apparatus and heat treatment method
-
Application No.: US16379990Application Date: 2019-04-10
-
Publication No.: US11211265B2Publication Date: 2021-12-28
- Inventor: Satoshi Takagi , Hiroyuki Hayashi , Hsiulin Tsai
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Main IPC: F27B5/14
- IPC: F27B5/14 ; F26B19/00 ; H01L21/67 ; C23C16/455

Abstract:
A heat treatment apparatus includes a processing container that accommodates a plurality of substrates, a gas supply unit that supplies a raw material gas into the processing container, an exhaust unit that exhausts the raw material gas in the processing container, and a heating unit that heats the plurality of substrates. The gas supply unit includes a gas supply pipe including: a first straight pipe portion that extends upward along a longitudinal direction of an inner wall surface of the processing container; a bent portion where a distal end side that extends above the first straight pipe portion is bent downward; a second straight pipe portion that extends downward from the bent portion; and a plurality of gas ejecting holes formed on the second straight pipe portion. The first straight pipe portion has a larger cross-sectional area than the second straight pipe portion.
Public/Granted literature
- US20190318945A1 HEAT TREATMENT APPARATUS AND HEAT TREATMENT METHOD Public/Granted day:2019-10-17
Information query