Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
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Application No.: US16556014Application Date: 2019-08-29
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Publication No.: US11211267B2Publication Date: 2021-12-28
- Inventor: Yasuhito Yoshimizu , Hakuba Kitagawa , Takaumi Morita
- Applicant: TOSHIBA MEMORY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JPJP2018-245620 20181227
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/67 ; H01L21/673 ; H01L21/445
Abstract:
According to one embodiment, a substrate processing apparatus includes a table configured to place a substrate thereon and to connect the substrate to a positive electrode, an counter electrode located opposite to the table, having a plurality of holes, and connected to a negative electrode, and a holding unit located opposite to the table across the counter electrode and configured to supply a chemical liquid to the counter electrode while holding the counter electrode.
Public/Granted literature
- US20200211864A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Public/Granted day:2020-07-02
Information query
IPC分类:
