公开(公告)号：US20180269082A1

公开(公告)日：2018-09-20

申请号：US15920956

申请日：2018-03-14

Applicant: Toshiba Memory Corporation

Inventor： Yasuhito Yoshimizu ,  Yuya Akeboshi ,  Fuyuma Ito ,  Hakuba Kitagawa

IPC: H01L21/67 ,  H01L21/311 ,  H01L21/3213

CPC classification number: H01L21/67075 ,  H01L21/31144 ,  H01L21/32134 ,  H01L21/32139 ,  H01L21/67046 ,  H01L21/6708 ,  H01L21/67086

Abstract: According to an embodiment, a substrate treatment apparatus includes a hair member including a noble metal, and a liquid chemical supply member to supply a liquid chemical. While a tip part of the hair member is contact with a predetermined surface of a metal, the liquid chemical is supplied onto the surface of the metal, and the metal is removed with etching.

公开(公告)号：US11211267B2

公开(公告)日：2021-12-28

申请号：US16556014

申请日：2019-08-29

Applicant: TOSHIBA MEMORY CORPORATION

Inventor： Yasuhito Yoshimizu ,  Hakuba Kitagawa ,  Takaumi Morita

IPC: H01L21/44 ,  H01L21/67 ,  H01L21/673 ,  H01L21/445

Abstract: According to one embodiment, a substrate processing apparatus includes a table configured to place a substrate thereon and to connect the substrate to a positive electrode, an counter electrode located opposite to the table, having a plurality of holes, and connected to a negative electrode, and a holding unit located opposite to the table across the counter electrode and configured to supply a chemical liquid to the counter electrode while holding the counter electrode.

公开(公告)号：US11171022B2

公开(公告)日：2021-11-09

申请号：US16278757

申请日：2019-02-19

Applicant: TOSHIBA MEMORY CORPORATION

Inventor： Hakuba Kitagawa ,  Yasuhito Yoshimizu ,  Fuyuma Ito ,  Hiroyuki Tanizaki

IPC: H01L21/67 ,  H01L21/3213

Abstract: In one embodiment, a substrate treatment apparatus includes a supporter configured to support and rotate a substrate, and a liquid supplier configured to supply a liquid to the substrate. The apparatus further includes a wall provided separately from the supporter and at least partially surrounding the supporter, and a detector provided between the supporter and the wall and configured to detect a change in the liquid.

公开(公告)号：US20200091092A1

公开(公告)日：2020-03-19

申请号：US16288896

申请日：2019-02-28

Applicant: TOSHIBA MEMORY CORPORATION

Inventor： Fuyuma Ito ,  Yasuhito Yoshimizu ,  Hakuba Kitagawa

IPC: H01L23/00 ,  H01L21/67 ,  H01J37/32

Abstract: In one embodiment, a substrate treatment apparatus includes a substrate holder configured to hold a substrate provided with a film. The apparatus further includes a film treatment module configured to treat the film in accordance with warpage of the substrate such that the film includes a first region having a first film quality or a first film thickness and a second region having a second film quality or a second film thickness different from the first film quality or the first film thickness.

公开(公告)号：US10804221B2

公开(公告)日：2020-10-13

申请号：US16288896

申请日：2019-02-28

Applicant: TOSHIBA MEMORY CORPORATION

Inventor： Fuyuma Ito ,  Yasuhito Yoshimizu ,  Hakuba Kitagawa

IPC: H01L23/00 ,  H01L21/67 ,  H01J37/32

Abstract: In one embodiment, a substrate treatment apparatus includes a substrate holder configured to hold a substrate provided with a film. The apparatus further includes a film treatment module configured to treat the film in accordance with warpage of the substrate such that the film includes a first region having a first film quality or a first film thickness and a second region having a second film quality or a second film thickness different from the first film quality or the first film thickness.