Invention Grant
- Patent Title: Light emitting device package
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Application No.: US16244882Application Date: 2019-01-10
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Publication No.: US11217623B2Publication Date: 2022-01-04
- Inventor: Joo-sung Kim , Jong-uk Seo , Dong-gun Lee , Young-jo Tak
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2018-0083135 20180717
- Main IPC: H01L27/15
- IPC: H01L27/15 ; H01L33/50 ; H01L33/00 ; H01L33/62 ; H01L33/12 ; H01L33/32 ; H01L33/06

Abstract:
A light emitting device package includes a cell array having a first surface and a second surface located opposite to the first surface and including, on a portion of a horizontal extension line of the first surface, semiconductor light emitting units each including a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer sequentially located on a layer surface including a sidewall of the first conductivity type semiconductor layer; wavelength converting units corresponding respectively to the semiconductor light emitting units and each arranged corresponding to the first conductivity type semiconductor layer; a barrier structure arranged between the wavelength converting units corresponding to the cell array; and switching units arranged in the barrier structure and electrically connected to the semiconductor light emitting units.
Public/Granted literature
- US20200027917A1 LIGHT EMITTING DEVICE PACKAGE Public/Granted day:2020-01-23
Information query
IPC分类: