Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16806629Application Date: 2020-03-02
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Publication No.: US11217667B2Publication Date: 2022-01-04
- Inventor: Seokhoon Kim , Dongmyoung Kim , Kanghun Moon , Hyunkwan Yu , Sanggil Lee , Seunghun Lee , Sihyung Lee , Choeun Lee , Edward Namkyu Cho , Yang Xu
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2019-0089217 20190723
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L29/78 ; H01L27/088 ; H01L29/06

Abstract:
A semiconductor device includes a substrate, a fin structure on the substrate, a gate structure on the fin structure, a gate spacer on at least on side surface of the gate structure, and a source/drain structure on the fin structure, wherein a topmost portion of a bottom surface of the gate spacer is lower than a topmost portion of a top surface of the fin structure, and a topmost portion of a top surface of the source/drain structure is lower than the topmost portion of the top surface of the fin structure.
Public/Granted literature
- US20210028281A1 SEMICONDUCTOR DEVICE Public/Granted day:2021-01-28
Information query
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