SEMICONDUCTOR DEVICE INCLUDING A FIELD EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20230059169A1

    公开(公告)日:2023-02-23

    申请号:US17718795

    申请日:2022-04-12

    摘要: A semiconductor device includes: an active pattern disposed on a substrate; a source/drain pattern disposed on the active pattern; a channel pattern connected to the source/drain pattern, wherein the channel pattern includes semiconductor patterns stacked on each other and spaced apart from each other; and a gate electrode disposed on the channel pattern and extending in a first direction, wherein the gate electrode includes: a channel neighboring part adjacent to a first sidewall of a first semiconductor pattern of the stacked semiconductor patterns; and a body part spaced apart from the first semiconductor pattern, wherein the channel neighboring part is disposed between the body part and the first semiconductor pattern, wherein the first sidewall of the first semiconductor pattern has a first width, wherein the channel neighboring part has a second width less than the first width. The body part has a third width greater than the second width.

    METHOD AND DEVICE FOR SELECTIVE USER PLANE SECURITY IN WIRELESS COMMUNICATION SYSTEM

    公开(公告)号:US20230145440A1

    公开(公告)日:2023-05-11

    申请号:US18092690

    申请日:2023-01-03

    IPC分类号: H04W12/033

    CPC分类号: H04W12/033

    摘要: An example security processing method includes receiving data packets at a packet data convergence protocol (PDCP) layer from an upper layer and parsing header information of each of the data packets to determine a length of each of the plurality of headers within the corresponding header information and whether a security header is present or absent in the corresponding data packets. The method further includes identifying corresponding header information of the data packets in which the security header is present based on the determination. The method further includes encrypting, based on the determined header lengths, only each of the plurality of headers of the identified corresponding header information in which the security header is present, and thereafter transmitting the one or more data packets to a lower layer after adding information regarding each of the encrypted headers along with their encryption length into a PDCP header.

    Semiconductor devices
    6.
    发明授权

    公开(公告)号:US12062662B2

    公开(公告)日:2024-08-13

    申请号:US18142210

    申请日:2023-05-02

    IPC分类号: H01L27/092 H01L29/78

    CPC分类号: H01L27/0924 H01L29/7851

    摘要: A semiconductor device includes a plurality of active fins extending in a first direction, and spaced apart from each other in a second direction, the plurality of active fins having upper surfaces of different respective heights, a gate structure extending in the second across the plurality of active fins, a device isolation film on the substrate, a source/drain region on the plurality of active fins, and including an epitaxial layer on the plurality of active fins, an insulating spacer on an upper surface of the device isolation film and having a lateral asymmetry with respect to a center line of the source/drain region in a cross section taken along the second direction, an interlayer insulating region on the device isolation film and on the gate structure and the source/drain region, and a contact structure in the interlayer insulating region and electrically connected to the source/drain region.

    SEMICONDUCTOR DEVICES
    7.
    发明公开

    公开(公告)号:US20230275091A1

    公开(公告)日:2023-08-31

    申请号:US18142210

    申请日:2023-05-02

    IPC分类号: H01L27/092 H01L29/78

    CPC分类号: H01L27/0924 H01L29/7851

    摘要: A semiconductor device includes a plurality of active fins extending in a first direction, and spaced apart from each other in a second direction, the plurality of active fins having upper surfaces of different respective heights, a gate structure extending in the second across the plurality of active fins, a device isolation film on the substrate, a source/drain region on the plurality of active fins, and including an epitaxial layer on the plurality of active fins, an insulating spacer on an upper surface of the device isolation film and having a lateral asymmetry with respect to a center line of the source/drain region in a cross section taken along the second direction, an interlayer insulating region on the device isolation film and on the gate structure and the source/drain region, and a contact structure in the interlayer insulating region and electrically connected to the source/drain region.

    SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

    公开(公告)号:US20230068364A1

    公开(公告)日:2023-03-02

    申请号:US17718924

    申请日:2022-04-12

    摘要: A semiconductor device includes an active pattern provided on a substrate, a source/drain pattern provided on the active pattern, a channel pattern configured to be connected to the source/drain pattern, a gate electrode configured to be extended in a first direction and to cross the channel pattern, and a first spacer provided on a side surface of the gate electrode. The first spacer includes a fence portion provided on a side surface of the active pattern and below the source/drain pattern. The source/drain pattern includes a body portion and a neck portion between the body portion and the active pattern. The body portion includes a crystalline surface configured to be slantingly extended from the neck portion. The crystalline surface is configured to be spaced apart from an uppermost portion of the fence portion.

    SEMICONDUCTOR DEVICES
    9.
    发明申请

    公开(公告)号:US20220115375A1

    公开(公告)日:2022-04-14

    申请号:US17348962

    申请日:2021-06-16

    IPC分类号: H01L27/092 H01L29/78

    摘要: A semiconductor device includes a plurality of active fins extending in a first direction, and spaced apart from each other in a second direction, the plurality of active fins having upper surfaces of different respective heights, a gate structure extending in the second across the plurality of active fins, a device isolation film on the substrate, a source/drain region on the plurality of active fins, and including an epitaxial layer on the plurality of active fins, an insulating spacer on an upper surface of the device isolation film and having a lateral asymmetry with respect to a center line of the source/drain region in a cross section taken along the second direction, an interlayer insulating region on the device isolation film and on the gate structure and the source/drain region, and a contact structure in the interlayer insulating region and electrically connected to the source/drain region.

    Semiconductor devices
    10.
    发明授权

    公开(公告)号:US11670638B2

    公开(公告)日:2023-06-06

    申请号:US17348962

    申请日:2021-06-16

    IPC分类号: H01L27/092 H01L29/78

    CPC分类号: H01L27/0924 H01L29/7851

    摘要: A semiconductor device includes a plurality of active fins extending in a first direction, and spaced apart from each other in a second direction, the plurality of active fins having upper surfaces of different respective heights, a gate structure extending in the second across the plurality of active fins, a device isolation film on the substrate, a source/drain region on the plurality of active fins, and including an epitaxial layer on the plurality of active fins, an insulating spacer on an upper surface of the device isolation film and having a lateral asymmetry with respect to a center line of the source/drain region in a cross section taken along the second direction, an interlayer insulating region on the device isolation film and on the gate structure and the source/drain region, and a contact structure in the interlayer insulating region and electrically connected to the source/drain region.