Invention Grant
- Patent Title: Integrated assemblies comprising sense-amplifier-circuitry and wordline-driver-circuitry under memory cells of a memory array
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Application No.: US17125651Application Date: 2020-12-17
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Publication No.: US11227861B2Publication Date: 2022-01-18
- Inventor: Hiroki Fujisawa , Charles L. Ingalls , Richard J. Hill , Gurtej S. Sandhu , Scott J. Derner
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: G11C11/40
- IPC: G11C11/40 ; H01L25/18 ; G11C11/4091 ; H01L23/528 ; H01L27/108 ; G11C11/408 ; H01L29/78

Abstract:
Some embodiments include an integrated assembly having a base comprising sense-amplifier-circuitry, a first deck over the base, and a second deck over the first deck. The first deck includes a first portion of a first array of first memory cells, and includes a first portion of a second array of second memory cells. The second deck includes a second portion of the first array of the first memory cells, and includes a second portion of the second array of the second memory cells. A first digit line is associated with the first array, and a second digit line is associated with the second array. The first and second digit lines are comparatively coupled with one another through the sense-amplifier-circuitry.
Public/Granted literature
Information query