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公开(公告)号:US20240244820A1
公开(公告)日:2024-07-18
申请号:US18391522
申请日:2023-12-20
IPC分类号: H10B12/00
CPC分类号: H10B12/30
摘要: A microelectronic device includes memory array regions of memory cells each including a vertical stack structure comprising conductive structures vertically spaced from one another and horizontally extending through a vertical stack of memory cells. A staircase region is horizontally between two of the memory array regions horizontally neighboring one another and includes a first staircase structure horizontally extending from the vertical stack structure of a first of the two of the memory array regions and a second staircase structure horizontally extending from the vertical stack structure of a second of the two of the memory array regions. Lateral conductive contacts provide a conductive path between the first steps of the first staircase structure and the second steps of the second staircase structure. Related microelectronic devices, memory devices, and electronic systems are also described.
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公开(公告)号:US11705432B2
公开(公告)日:2023-07-18
申请号:US17365741
申请日:2021-07-01
IPC分类号: G11C5/04 , H01L25/065 , H01L25/00 , H01L23/00 , G11C11/4096 , H01L25/18
CPC分类号: H01L25/0657 , G11C11/4096 , H01L24/07 , H01L24/16 , H01L24/48 , H01L25/50 , H01L25/18 , H01L2224/0233 , H01L2224/02373 , H01L2224/02375 , H01L2224/02381 , H01L2224/16225 , H01L2224/48145 , H01L2224/48225 , H01L2225/0651 , H01L2225/06506 , H01L2225/06517 , H01L2225/06527 , H01L2225/06558 , H01L2225/06562 , H01L2225/06565
摘要: Systems, apparatuses, and methods using wire bonds and direct chip attachment (DCA) features in stacked die packages are described. A stacked die package includes a substrate and at least a first semiconductor die and a second semiconductor die that are vertically stacked above the substrate. An active surface of the first semiconductor die faces an upper surface of the substrate and the first semiconductor die is operably coupled to the substrate by direct chip attachment DCA features. A back side surface of the second semiconductor die faces a back side surface of the first semiconductor die. The second semiconductor die is operably coupled to the substrate by wire bonds extending between an active surface thereof and the upper surface of the substrate.
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公开(公告)号:US20210327856A1
公开(公告)日:2021-10-21
申请号:US17365741
申请日:2021-07-01
IPC分类号: H01L25/065 , H01L25/18 , H01L25/00 , H01L23/00 , G11C11/4096
摘要: Systems, apparatuses, and methods using wire bonds and direct chip attachment (DCA) features in stacked die packages are described. A stacked die package includes a substrate and at least a first semiconductor die and a second semiconductor die that are vertically stacked above the substrate. An active surface of the first semiconductor die faces an upper surface of the substrate and the first semiconductor die is operably coupled to the substrate by direct chip attachment DCA features. A back side surface of the second semiconductor die faces a back side surface of the first semiconductor die. The second semiconductor die is operably coupled to the substrate by wire bonds extending between an active surface thereof and the upper surface of the substrate.
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公开(公告)号:US20210066272A1
公开(公告)日:2021-03-04
申请号:US16553448
申请日:2019-08-28
IPC分类号: H01L25/18 , G11C11/4091 , H01L23/528 , G11C11/408 , H01L27/108
摘要: Some embodiments include an integrated assembly having a base comprising sense-amplifier-circuitry, a first deck over the base, and a second deck over the first deck. The first deck includes a first portion of a first array of first memory cells, and includes a first portion of a second array of second memory cells. The second deck includes a second portion of the first array of the first memory cells, and includes a second portion of the second array of the second memory cells. A first digit line is associated with the first array, and a second digit line is associated with the second array. The first and second digit lines are comparatively coupled with one another through the sense-amplifier-circuitry.
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公开(公告)号:US20170186479A1
公开(公告)日:2017-06-29
申请号:US15460206
申请日:2017-03-15
发明人: Hiromasa Takeda , Hiroki Fujisawa
IPC分类号: G11C11/4093 , G11C11/4094 , G11C11/4074
CPC分类号: G11C11/4093 , G11C7/04 , G11C7/1051 , G11C7/1057 , G11C11/4074 , G11C11/4094 , G11C29/022 , G11C29/028 , G11C2207/2254
摘要: An apparatus includes a first terminal configured to communicate data with an outside of the apparatus, a second terminal configured to receive a first power source potential, a third terminal configured to receive a second power source potential lower than the first power source potential, a fourth terminal configured to be coupled to a calibration resistor, an output buffer including first to third nodes coupled to the first to third terminals respectively, and a replica circuit including fourth and fifth nodes coupled to the second and third terminals respectively, and sixth node coupled to the fourth terminal.
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公开(公告)号:US20150235680A1
公开(公告)日:2015-08-20
申请号:US14622520
申请日:2015-02-13
发明人: Hiromasa Takeda , Hiroki Fujisawa
IPC分类号: G11C7/10
CPC分类号: G11C11/4093 , G11C7/04 , G11C7/1051 , G11C7/1057 , G11C11/4074 , G11C11/4094 , G11C29/022 , G11C29/028 , G11C2207/2254
摘要: An apparatus includes a first terminal configured to communicate data with an outside of the apparatus, a second terminal configured to receive a first power source potential, a third terminal configured to receive a second power source potential lower than the first power source potential, a fourth terminal configured to be coupled to a calibration resistor, an output buffer including first to third nodes coupled to the first to third terminals respectively, and a replica circuit including fourth and fifth nodes coupled to the second and third terminals respectively, and sixth node coupled to the fourth terminal.
摘要翻译: 一种装置包括:第一终端,被配置为与设备的外部通信数据;第二终端,被配置为接收第一电源电位;第三终端,被配置为接收低于第一电源电位的第二电源电位;第四终端, 被配置为耦合到校准电阻器的输出缓冲器,包括分别耦合到第一至第三端子的第一至第三节点的输出缓冲器以及分别耦合到第二和第三端子的第四和第五节点的复制电路,以及耦合到 第四个终端。
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公开(公告)号:US11646092B2
公开(公告)日:2023-05-09
申请号:US17187124
申请日:2021-02-26
发明人: Susumu Takahashi , Hiroki Fujisawa
CPC分类号: G11C29/42 , G11B20/1833 , G11C7/1009 , G11C8/10 , G11C8/12 , G11C2216/22
摘要: Systems and methods related to memory devices that may perform error check and correct (ECC) functionality. The systems and methods may employ ECC logic that may be shared between two or more banks. The ECC logic may be used to perform memory operations such as read, write, and masked-write operations, and may increase reliability of storage data.
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公开(公告)号:US20210183462A1
公开(公告)日:2021-06-17
申请号:US17187124
申请日:2021-02-26
发明人: Susumu Takahashi , Hiroki Fujisawa
摘要: Systems and methods related to memory devices that may perform error check and correct (ECC) functionality. The systems and methods may employ ECC logic that may be shared between two or more banks. The ECC logic may be used to perform memory operations such as read, write, and masked-write operations, and may increase reliability of storage data.
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公开(公告)号:US10210922B2
公开(公告)日:2019-02-19
申请号:US15962886
申请日:2018-04-25
发明人: Kenji Yoshida , Hiroki Fujisawa
IPC分类号: G11C7/00 , G11C11/406 , G11C11/4074 , G11C11/4076 , G11C11/4094
摘要: Apparatuses and methods for refreshing memory cells of a semiconductor device are described. An example apparatus includes: a memory cell array including a plurality of memory groups each having a plurality of memory cells, the memory groups being selected by mutually different addresses; a first control circuit periodically executing a refresh operation on the memory groups in response to a first refresh command; and a second control circuit setting a cycle of executing the refresh operation by the first control circuit. The second control circuit sets the cycle to a first cycle until executing the refresh operation to all the memory groups after receiving the first refresh command, and the second control circuit sets the cycle to a second cycle that is longer than the first cycle after executing the refresh operation to all the memory groups.
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公开(公告)号:US09984738B2
公开(公告)日:2018-05-29
申请号:US15499568
申请日:2017-04-27
发明人: Kenji Yoshida , Hiroki Fujisawa
IPC分类号: G11C7/00 , G11C11/406 , G11C11/4094
CPC分类号: G11C11/40626 , G11C11/40611 , G11C11/40615 , G11C11/4074 , G11C11/4076 , G11C11/4094 , G11C2211/4061
摘要: Apparatuses and methods for refreshing memory cells of semiconductor device are described. An example apparatus includes: a memory cell array including a plurality of memory groups each having a plurality of memory cells, the memory groups being selected by mutually different addresses; a first control circuit periodically executing a refresh operation on the memory groups in response to a first refresh command; and a second control circuit setting a cycle of executing the refresh operation by the first control circuit. The second control circuit sets the cycle to a first cycle until executing the refresh operation to all the memory groups after receiving the first refresh command, and the second control circuit sets the cycle to a second cycle that is longer than the first cycle after executing the refresh operation to all the memory groups.
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