Invention Grant
- Patent Title: Semiconductor structure
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Application No.: US16686272Application Date: 2019-11-18
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Publication No.: US11239412B2Publication Date: 2022-02-01
- Inventor: Yu-Chun Chen , Ya-Sheng Feng , Chiu-Jung Chiu
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsinchu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, PC
- Priority: CN201910982171.1 20191016
- Main IPC: H01L43/02
- IPC: H01L43/02 ; H01L43/12
Abstract:
A semiconductor structure includes an electrode element with an upper surface. The upper surface includes at least one convex curved portion.
Public/Granted literature
- US20210119111A1 SEMICONDUCTOR STRUCTURE Public/Granted day:2021-04-22
Information query
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