Invention Grant
- Patent Title: Temperature compensation circuits
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Application No.: US16227578Application Date: 2018-12-20
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Publication No.: US11244944B2Publication Date: 2022-02-08
- Inventor: Amit Kundu , Chia-Hsin Hu , Jaw-Juinn Horng
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: H01L27/08
- IPC: H01L27/08 ; H01L27/088 ; H01L21/8234 ; G05F1/56 ; H01L29/06 ; H01L29/49 ; H01L29/66 ; H01L29/78

Abstract:
The present disclosure relates generally to integrated circuits, and more particularly to low-bias voltage reference circuits. The voltage reference circuits are capable of providing highly-accurate and temperature-insensitive outputs. Specifically, the present disclosure provides complementary-to-absolute-temperature circuits with low process variation and tunable temperature coefficient.
Public/Granted literature
- US20190131299A1 Temperature Compensation Circuits Public/Granted day:2019-05-02
Information query
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