Invention Grant
- Patent Title: Method of fabricating package structure
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Application No.: US16881013Application Date: 2020-05-22
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Publication No.: US11251142B2Publication Date: 2022-02-15
- Inventor: Chia-Hsiang Lin , Feng-Cheng Hsu , Shuo-Mao Chen , Shin-Puu Jeng , Arunima Banerjee
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/48 ; H01L23/498 ; H01L21/683 ; H01L25/10 ; H01L23/31 ; H01L25/065
Abstract:
A package structure including a semiconductor die, a redistribution layer and a plurality of conductive elements is provided. At least one joint of the joints in the redistribution layer or on the semiconductor die is connected with the conductive element for electrically connecting the redistribution layer, the semiconductor die and the conductive elements. The fabrication methods for forming a package structure are provided.
Public/Granted literature
- US20200286744A1 METHOD OF FABRICATING PACKAGE STRUCTURE Public/Granted day:2020-09-10
Information query
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