Invention Grant
- Patent Title: Extended package air core inductor
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Application No.: US16402467Application Date: 2019-05-03
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Publication No.: US11264160B2Publication Date: 2022-03-01
- Inventor: Eng Huat Goh , Jiun Hann Sir , Min Suet Lim , Chin Lee Kuan , Siew Fong Yap
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Priority: MYPI2018702566 20180723
- Main IPC: H01F27/02
- IPC: H01F27/02 ; G05F1/56
Abstract:
An electronic device comprises an air core inductor including an electronic semiconductor package including a first portion of the air core inductor internal to the electronic semiconductor package; and an electrically conductive layer arranged on a first external surface of the electronic semiconductor package and electrically connected as a second portion of the air core inductor.
Public/Granted literature
- US20200027639A1 EXTENDED PACKAGE AIR CORE INDUCTOR Public/Granted day:2020-01-23
Information query
