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公开(公告)号：US11264160B2
公开(公告)日：2022-03-01
申请号：US16402467
申请日：2019-05-03
Applicant: Intel Corporation
Inventor： Eng Huat Goh , Jiun Hann Sir , Min Suet Lim , Chin Lee Kuan , Siew Fong Yap
Abstract: An electronic device comprises an air core inductor including an electronic semiconductor package including a first portion of the air core inductor internal to the electronic semiconductor package; and an electrically conductive layer arranged on a first external surface of the electronic semiconductor package and electrically connected as a second portion of the air core inductor.
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公开(公告)号：US20200027639A1
公开(公告)日：2020-01-23
申请号：US16402467
申请日：2019-05-03
Applicant: Intel Corporation
Inventor： Eng Huat Goh , Jiun Hann Sir , Min Suet Lim , Chin Lee Kuan , Siew Fong Yap
Abstract: An electronic device comprises an air core inductor including an electronic semiconductor package including a first portion of the air core inductor internal to the electronic semiconductor package; and an electrically conductive layer arranged on a first external surface of the electronic semiconductor package and electrically connected as a second portion of the air core inductor.
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