Invention Grant
- Patent Title: Wafer inspection using difference images
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Application No.: US15971536Application Date: 2018-05-04
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Publication No.: US11270430B2Publication Date: 2022-03-08
- Inventor: Abdurrahman Sezginer , Xiaochun Li , Pavan Kumar , Junqing Huang , Lisheng Gao , Grace H. Chen , Yalin Xiong , Hawren Fang
- Applicant: KLA-TENCOR CORPORATION
- Applicant Address: US CA Milpitas
- Assignee: KLA-TENCOR CORPORATION
- Current Assignee: KLA-TENCOR CORPORATION
- Current Assignee Address: US CA Milpitas
- Agency: Hodgson Russ LLP
- Main IPC: G06T7/00
- IPC: G06T7/00

Abstract:
Systems and methods increase the signal to noise ratio of optical inspection of wafers to obtain higher inspection sensitivity. The computed reference image can minimize a norm of the difference of the test image and the computed reference image. A difference image between the test image and a computed reference image is determined. The computed reference image includes a linear combination of a second set of images.
Public/Granted literature
- US20180342051A1 WAFER INSPECTION USING DIFFERENCE IMAGES Public/Granted day:2018-11-29
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